Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8981560 | Method and structure of sensors and MEMS devices using vertical mounting with interconnections | Dave Paul Jensen, Hong Wan | 2015-03-17 |
| 8476129 | Method and structure of sensors and MEMS devices using vertical mounting with interconnections | Dave Paul Jensen, Hong Wan | 2013-07-02 |
| 6093029 | Vertically stackable integrated circuit | Young-Han Kwon, Bill Gervasi, Paul R. Franklin, Jr. | 2000-07-25 |
| 5159750 | Method of connecting an IC component with another electrical component | Vivek B. Dutta, Jeffrey C. Demmin, Mark L. DiOrio | 1992-11-03 |
| 5008734 | Stadium-stepped package for an integrated circuit with air dielectric | Vivek B. Dutta, Jeffrey C. Demmin, Mark L. DiOrio | 1991-04-16 |
| 4833102 | Process of making a ceramic lid for use in a hermetic seal package | Robert C. Byrne, Chee-Men Yu | 1989-05-23 |
| 4769272 | Ceramic lid hermetic seal package structure | Robert C. Byrne, Chee-Men Yu | 1988-09-06 |