Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7405581 | Probing system uses a probe device including probe tips on a surface of a semiconductor die | — | 2008-07-29 |
| 7144759 | Technology partitioning for advanced flip-chip packaging | Robert M. Hilton | 2006-12-05 |
| 6984996 | Wafer probing that conditions devices for flip-chip bonding | Robert M. Hilton | 2006-01-10 |
| 6975127 | Planarizing and testing of BGA packages | — | 2005-12-13 |
| 5159750 | Method of connecting an IC component with another electrical component | Vivek B. Dutta, Jeffrey C. Demmin, Jon T. Ewanich | 1992-11-03 |
| 5146310 | Thermally enhanced leadframe | Jaime A. Bayan, Jeffrey C. Demmin, Young I. Kwon | 1992-09-08 |
| 5008734 | Stadium-stepped package for an integrated circuit with air dielectric | Vivek B. Dutta, Jeffrey C. Demmin, Jon T. Ewanich | 1991-04-16 |