| 7144759 |
Technology partitioning for advanced flip-chip packaging |
Mark L. DiOrio |
2006-12-05 |
| 6984996 |
Wafer probing that conditions devices for flip-chip bonding |
Mark L. DiOrio |
2006-01-10 |
| 6940182 |
Flip-chip package with underfill dam for stress control |
Sabran B. Samsuri |
2005-09-06 |
| 6762509 |
Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill material |
Sabran B. Samsuri |
2004-07-13 |
| 6737752 |
Flip-chip package containing a chip and a substrate having differing pitches for electrical connections |
— |
2004-05-18 |
| 6699732 |
Pitch compensation in flip-chip packaging |
— |
2004-03-02 |
| 6576073 |
Adhesive control during stiffener attachment to provide co-planarity in flip chip packages |
Sabran B. Samsuri |
2003-06-10 |
| 5493985 |
Process and apparatus for controlled synthesis and in-situ single crystal growth of phosphorus compounds and the crystals therefrom |
David F. Bliss, Joseph A. Adamski |
1996-02-27 |
| 5431125 |
Twin-free crystal growth of III-V semiconductor material |
Stephen Bachowski, David F. Bliss |
1995-07-11 |
| 5252175 |
Capillary pressure relief for magnetic Kyropoulos growth of semiconductor crystals |
Steven Bachowski, Brian S. Ahern, Joseph A. Adamski |
1993-10-12 |
| 4963334 |
High temperature heat pipe coracle and process |
Brian S. Ahern |
1990-10-16 |