Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6940182 | Flip-chip package with underfill dam for stress control | Robert M. Hilton | 2005-09-06 |
| 6762509 | Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill material | Robert M. Hilton | 2004-07-13 |
| 6576073 | Adhesive control during stiffener attachment to provide co-planarity in flip chip packages | Robert M. Hilton | 2003-06-10 |