Issued Patents All Time
Showing 51–75 of 146 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8941235 | Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate | — | 2015-01-27 |
| 8884430 | Semiconductor device and method of confining conductive bump material during reflow with solder mask patch | — | 2014-11-11 |
| 8853001 | Semiconductor device and method of forming pad layout for flipchip semiconductor die | — | 2014-10-07 |
| 8841779 | Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate | — | 2014-09-23 |
| 8810029 | Solder joint flip chip interconnection | KyungOe Kim, TaeWoo Kang | 2014-08-19 |
| 8759972 | Semiconductor device and method of forming composite bump-on-lead interconnection | — | 2014-06-24 |
| 8741766 | Semiconductor device and method of confining conductive bump material during reflow with solder mask patch | — | 2014-06-03 |
| 8697490 | Flip chip interconnection structure | — | 2014-04-15 |
| 8674500 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2014-03-18 |
| 8659172 | Semiconductor device and method of confining conductive bump material with solder mask patch | — | 2014-02-25 |
| RE44761 | Solder joint flip chip interconnection having relief structure | KyungOe Kim, TaeWoo Kang | 2014-02-11 |
| RE44608 | Solder joint flip chip interconnection | KyungOe Kim, TaeWoo Kang | 2013-11-26 |
| 8575018 | Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area | Yaojian Lin, Jianmin Fang, Kang Chen, Pandi C. Marimuthu | 2013-11-05 |
| 8574959 | Semiconductor device and method of forming bump-on-lead interconnection | — | 2013-11-05 |
| RE44579 | Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask | — | 2013-11-05 |
| RE44562 | Solder joint flip chip interconnection having relief structure | KyungOe Kim, TaeWoo Kang | 2013-10-29 |
| 8558378 | Bump-on-lead flip chip interconnection | — | 2013-10-15 |
| RE44524 | Bump-on-lead flip chip interconnection | — | 2013-10-08 |
| RE44500 | Semiconductor device and method of forming composite bump-on-lead interconnection | — | 2013-09-17 |
| 8525337 | Semiconductor device and method of forming stud bumps over embedded die | — | 2013-09-03 |
| 8525350 | Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps | — | 2013-09-03 |
| RE44431 | Bump-on-lead flip chip interconnection | — | 2013-08-13 |
| RE44438 | Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate | — | 2013-08-13 |
| RE44377 | Bump-on-lead flip chip interconnection | — | 2013-07-16 |
| RE44355 | Method of forming a bump-on-lead flip chip interconnection having higher escape routing density | — | 2013-07-09 |