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Jun Mo Koo — 43 Patents

SCStats Chippac: 21 patents #52 of 425Top 15%

Samsung: 16 patents #8,594 of 75,807Top 15%

SCSk Telecom Co.: 4 patents #159 of 842Top 20%

SFSeoul National University Industry Foundation: 2 patents #101 of 804Top 15%

JCJcet Semiconductor (Shaoxing) Co.: 1 patents #18 of 38Top 50%

Suwon-si, KR: #586 of 18,685 inventorsTop 4%

Overall (All Time): #69,380 of 4,157,543Top 2%

43 Patents All Time

Jun Mo Koo has been granted 43 US patents while listed as an inventor at Samsung. The first was granted in 1999 and the most recent in September 2025. Jun Mo Koo ranks #69,380 of 4,157,543 US inventors in our database (top 1.7%). Patent records list Jun Mo Koo in Suwon-si, KR.

Patents per Year

Issued Patents All Time

Showing 1–25 of 43 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12411274	Polarizing plate and optical display device including same	Sang Hum LEE, Bong Choon KIM, Jung Hun YOU, Dong Yoon Shin	2025-09-09
12372689	Polarizer protective film, polarization plate comprising same, and optical display apparatus comprising same	Bong Choon KIM, Jung Hun YOU, Sang Hum LEE, Dong Yoon Shin	2025-07-29
12360303	Polarizing plate and optical display apparatus comprising same	Bong Choon KIM, Jung Hun YOU, Sang Hum LEE, Dong Yoon Shin	2025-07-15
12271016	Polarizing plate and optical display apparatus comprising the same	Bong Choon KIM, Dong Yoon Shin, Jung Hun YOU, Sang Hum LEE	2025-04-08
12253705	Polarizing plate and optical display apparatus comprising the same	Bong Choon KIM, Dong Yoon Shin, Jung Hun YOU, Sang Hum LEE	2025-03-18
12210177	Polarizing plate and optical display device comprising same	Bong Choon KIM, Dong Yoon Shin, Jung Hun YOU, Sang Hum LEE	2025-01-28
12196996	Optical film, polarizing plate including same, and display device including same	Jung Hun YOU, Sang Hum LEE, Dong Yoon Shin	2025-01-14
12158600	Polarizing plate and optical display apparatus comprising the same	Jung Hun YOU, Sang Hum LEE, Bong Choon KIM, Yoon Jung Kim, Ri Ra Jung +4 more	2024-12-03
12066646	Polarizing plate and optical display device comprising same	Jung Hun YOU, Sang Hum LEE, Bong Choon KIM, Kwang Ho Shin	2024-08-20
11880055	Polarizing plate and display device including same	Jung Hun YOU, Bong Choon KIM, Sang Hum LEE, Dong Yoon Shin	2024-01-23
11726248	Polarizing plate and optical display apparatus comprising the same	Jung Hun YOU, Sang Hum LEE, Bong Choon KIM, Yoon Jung Kim, Ri Ra Jung +4 more	2023-08-15
11688612	Semiconductor device and method of forming interposer with opening to contain semiconductor die	Reza A. Pagaila, Yaojian Lin, HeeJo Chi	2023-06-27
11681085	Polarizing plate and optical display apparatus comprising the same	Bong Choon KIM, Dong Yoon Shin, Jung Hun YOU, Sang Hum LEE	2023-06-20
10998248	Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die	Reza A. Pagaila, Yaojian Lin	2021-05-04
10242948	Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package	Il Kwon Shim, Pandi C. Marimuthu, Yaojian Lin, See Chian Lim	2019-03-26
9875911	Semiconductor device and method of forming interposer with opening to contain semiconductor die	Reza A. Pagaila, Yaojian Lin, HeeJo Chi	2018-01-23
9679824	Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP	Reza A. Pagaila, Rajendra D. Pendse	2017-06-13
9620455	Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure	Reza A. Pagaila, Yaojian Lin	2017-04-11
9559039	Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package	Il Kwon Shim, Pandi C. Marimuthu, Yaojian Lin, See Chian Lim	2017-01-31
9437538	Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect	Reza A. Pagaila, Yaojian Lin	2016-09-06
9337116	Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die	Reza A. Pagaila, Yaojian Lin	2016-05-10
9318441	Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die	Reza A. Pagaila, Yaojian Lin	2016-04-19
9305854	Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package	Il Kwon Shim	2016-04-05
9263301	Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die	Reza A. Pagaila, Yaojian Lin	2016-02-16
9224647	Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer	Pandi C. Marimuthu, Jae Hun Ku, Seung Wook Yoon	2015-12-29