Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12411274 | Polarizing plate and optical display device including same | Sang Hum LEE, Bong Choon KIM, Jung Hun YOU, Dong Yoon Shin | 2025-09-09 |
| 12372689 | Polarizer protective film, polarization plate comprising same, and optical display apparatus comprising same | Bong Choon KIM, Jung Hun YOU, Sang Hum LEE, Dong Yoon Shin | 2025-07-29 |
| 12360303 | Polarizing plate and optical display apparatus comprising same | Bong Choon KIM, Jung Hun YOU, Sang Hum LEE, Dong Yoon Shin | 2025-07-15 |
| 12271016 | Polarizing plate and optical display apparatus comprising the same | Bong Choon KIM, Dong Yoon Shin, Jung Hun YOU, Sang Hum LEE | 2025-04-08 |
| 12253705 | Polarizing plate and optical display apparatus comprising the same | Bong Choon KIM, Dong Yoon Shin, Jung Hun YOU, Sang Hum LEE | 2025-03-18 |
| 12210177 | Polarizing plate and optical display device comprising same | Bong Choon KIM, Dong Yoon Shin, Jung Hun YOU, Sang Hum LEE | 2025-01-28 |
| 12196996 | Optical film, polarizing plate including same, and display device including same | Jung Hun YOU, Sang Hum LEE, Dong Yoon Shin | 2025-01-14 |
| 12158600 | Polarizing plate and optical display apparatus comprising the same | Jung Hun YOU, Sang Hum LEE, Bong Choon KIM, Yoon Jung Kim, Ri Ra Jung +4 more | 2024-12-03 |
| 12066646 | Polarizing plate and optical display device comprising same | Jung Hun YOU, Sang Hum LEE, Bong Choon KIM, Kwang Ho Shin | 2024-08-20 |
| 11880055 | Polarizing plate and display device including same | Jung Hun YOU, Bong Choon KIM, Sang Hum LEE, Dong Yoon Shin | 2024-01-23 |
| 11726248 | Polarizing plate and optical display apparatus comprising the same | Jung Hun YOU, Sang Hum LEE, Bong Choon KIM, Yoon Jung Kim, Ri Ra Jung +4 more | 2023-08-15 |
| 11688612 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Reza A. Pagaila, Yaojian Lin, HeeJo Chi | 2023-06-27 |
| 11681085 | Polarizing plate and optical display apparatus comprising the same | Bong Choon KIM, Dong Yoon Shin, Jung Hun YOU, Sang Hum LEE | 2023-06-20 |
| 10998248 | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die | Reza A. Pagaila, Yaojian Lin | 2021-05-04 |
| 10242948 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Pandi C. Marimuthu, Yaojian Lin, See Chian Lim | 2019-03-26 |
| 9875911 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Reza A. Pagaila, Yaojian Lin, HeeJo Chi | 2018-01-23 |
| 9679824 | Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP | Reza A. Pagaila, Rajendra D. Pendse | 2017-06-13 |
| 9620455 | Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure | Reza A. Pagaila, Yaojian Lin | 2017-04-11 |
| 9559039 | Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package | Il Kwon Shim, Pandi C. Marimuthu, Yaojian Lin, See Chian Lim | 2017-01-31 |
| 9437538 | Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect | Reza A. Pagaila, Yaojian Lin | 2016-09-06 |
| 9337116 | Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die | Reza A. Pagaila, Yaojian Lin | 2016-05-10 |
| 9318441 | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die | Reza A. Pagaila, Yaojian Lin | 2016-04-19 |
| 9305854 | Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package | Il Kwon Shim | 2016-04-05 |
| 9263301 | Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die | Reza A. Pagaila, Yaojian Lin | 2016-02-16 |
| 9224647 | Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer | Pandi C. Marimuthu, Jae Hun Ku, Seung Wook Yoon | 2015-12-29 |