JK

Jun Mo Koo

SC Stats Chippac: 21 patents #63 of 425Top 15%
Samsung: 16 patents #8,525 of 75,807Top 15%
SC Sk Telecom Co.: 4 patents #159 of 842Top 20%
SF Seoul National University Industry Foundation: 2 patents #101 of 804Top 15%
JC Jcet Semiconductor (Shaoxing) Co.: 1 patents #18 of 38Top 50%
Overall (All Time): #68,725 of 4,157,543Top 2%
43
Patents All Time

Issued Patents All Time

Showing 26–43 of 43 patents

Patent #TitleCo-InventorsDate
9142515 Semiconductor device with protective layer over exposed surfaces of semiconductor die Reza A. Pagaila, DaeSik Choi 2015-09-22
8999760 Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure Reza A. Pagaila, Yaojian Lin 2015-04-07
8993377 Semiconductor device and method of bonding different size semiconductor die at the wafer level Pandi C. Marimuthu, Seung Wook Yoon, Il Kwon Shim 2015-03-31
8866294 Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation Reza A. Pagaila, Yaojian Lin 2014-10-21
8796137 Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect Reza A. Pagaila, Yaojian Lin 2014-08-05
8642381 Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die Reza A. Pagaila, DaeSik Choi 2014-02-04
8435834 Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP Reza A. Pagaila, Rajendra D. Pendse 2013-05-07
8288201 Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die Reza A. Pagaila, Yaojian Lin 2012-10-16
8241964 Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation Reza A. Pagaila, Yaojian Lin 2012-08-14
8236617 Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure Reza A. Pagaila, Yaojian Lin 2012-08-07
8009971 Hand-shake correction method and apparatus of camera module for use in mobile device Jin Young Choi, Byung-Kwon Kang, Dong-Hoon Jang, Pyo-Jae Kim, Dong-Sung Song +1 more 2011-08-30
7979143 Apparatus and method for proportional-integral-derivative control Jin Young Choi, Dong-Hoon Jang, Byung-Kwon Kang, Pyo-Jae Kim, Dong-Sung Song +1 more 2011-07-12
7489340 Optical image stabilizer for camera lens assembly Myoung-Won Kim, Byung-Kwon Kang 2009-02-10
7254122 Apparatus and method for generating pilot beacon signal in base stations of CDMA system An-Na Choi, Jae Hwang Yu, Byung Moo Kim 2007-08-07
7215884 Optical demultiplexer having bragg diffration grating and optical communication module using the optical demultiplexer Se-Yoon Kim, Kyoung-Youm Kim 2007-05-08
6516007 Method for synchronizing reverse link and transmission method using synchronous reverse link Een Kee Hong, Dong Do Lee, Sang Yon Lee, Sung Jae Lee 2003-02-04
6009074 CDMA modulation and demodulation method reducing interference and a communication system using the same Je Woo Kim, Jin Ick Lee 1999-12-28
5956367 Rake receiving apparatus for direct sequence code division multiple access system Je Woo Kim, Jin Ick Lee 1999-09-21