| 12196969 |
Display device |
Sangwoo Ha, Tetsuo Ariyoshi, Ilseop Won, Jongpil Won |
2025-01-14 |
| 12072535 |
Display device |
Tetsuo Ariyoshi, Ilseop Won, Jongpil Won, Sangwoo Ha |
2024-08-27 |
| 8785251 |
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die |
Byoungwook Jang, DongSoo Moon |
2014-07-22 |
| 8692365 |
Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof |
DongSoo Moon, Taewoo Lee, Soo-San Park, Sang Ho Lee |
2014-04-08 |
| 8569895 |
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die |
Byoungwook Jang, DongSoo Moon |
2013-10-29 |
| 8193036 |
Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die |
Byoungwook Jang, DongSoo Moon |
2012-06-05 |
| 8143096 |
Integrated circuit package system flip chip |
KyungHoon Lee |
2012-03-27 |
| 8115293 |
Integrated circuit packaging system with interconnect and method of manufacture thereof |
DongSoo Moon, Taewoo Lee, Soo-San Park, Sang Ho Lee |
2012-02-14 |
| 7682872 |
Integrated circuit package system with underfill |
Tae Keun Lee, YoRim Lee |
2010-03-23 |
