Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12196969 | Display device | Sangwoo Ha, Tetsuo Ariyoshi, Ilseop Won, Jongpil Won | 2025-01-14 |
| 12072535 | Display device | Tetsuo Ariyoshi, Ilseop Won, Jongpil Won, Sangwoo Ha | 2024-08-27 |
| 8785251 | Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die | Byoungwook Jang, DongSoo Moon | 2014-07-22 |
| 8692365 | Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof | DongSoo Moon, Taewoo Lee, Soo-San Park, Sang Ho Lee | 2014-04-08 |
| 8569895 | Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die | Byoungwook Jang, DongSoo Moon | 2013-10-29 |
| 8193036 | Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die | Byoungwook Jang, DongSoo Moon | 2012-06-05 |
| 8143096 | Integrated circuit package system flip chip | KyungHoon Lee | 2012-03-27 |
| 8115293 | Integrated circuit packaging system with interconnect and method of manufacture thereof | DongSoo Moon, Taewoo Lee, Soo-San Park, Sang Ho Lee | 2012-02-14 |
| 7682872 | Integrated circuit package system with underfill | Tae Keun Lee, YoRim Lee | 2010-03-23 |