Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8143103 | Package stacking system with mold contamination prevention and method for manufacturing thereof | Young Joon Kim | 2012-03-27 |
| 7898072 | Package stacking system with mold contamination prevention | Youngjoon KIM | 2011-03-01 |
| 7875495 | Standoff height improvement for bumping technology using solder resist | TaeWoo Kang, TaeKeun Lee | 2011-01-25 |
| 7682872 | Integrated circuit package system with underfill | SooMoon Park, Tae Keun Lee | 2010-03-23 |
| 7615865 | Standoff height improvement for bumping technology using solder resist | TaeWoo Kang, TaeKeun Lee | 2009-11-10 |