Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349666 | Integrated circuit packaging system with package stacking | In Sang Yoon, DaeSik Choi | 2016-05-24 |
| 9330945 | Integrated circuit package system with multi-chip module | Sungmin Song, SeungYun Ahn, Jong-Woo Ha | 2016-05-03 |
| 9093392 | Integrated circuit packaging system with vertical interconnection and method of manufacture thereof | SungWon Cho, DaeSik Choi, DongSoo Moon | 2015-07-28 |
| 9093391 | Integrated circuit packaging system with fan-in package and method of manufacture thereof | SeungYun Ahn, Sangjin Lee | 2015-07-28 |
| 8772916 | Integrated circuit package system employing mold flash prevention technology | Ki Youn Jang, Sungmin Song | 2014-07-08 |
| 8699232 | Integrated circuit packaging system with interposer and method of manufacture thereof | A Leam Choi, DeokKyung Yang | 2014-04-15 |
| 8698297 | Integrated circuit packaging system with stack device | In Sang Yoon, DaeSik Choi | 2014-04-15 |
| 8674516 | Integrated circuit packaging system with vertical interconnects and method of manufacture thereof | Byung Joon Han, In Sang Yoon | 2014-03-18 |
| 8643181 | Integrated circuit packaging system with encapsulation and method of manufacture thereof | SeongHun Mun, SeungYun Ahn | 2014-02-04 |
| 8569869 | Integrated circuit packaging system with encapsulation and method of manufacture thereof | HyungSang Park, A Leam Choi | 2013-10-29 |
| 8501535 | Integrated circuit package system with dual side connection and method for manufacturing thereof | Sungmin Song, SeungYun Ahn | 2013-08-06 |
| 8497575 | Semiconductor packaging system with an aligned interconnect and method of manufacture thereof | In Sang Yoon, DeokKyung Yang | 2013-07-30 |
| 8461680 | Integrated circuit packaging system with rounded interconnect | DaeSik Choi, SungWon Cho | 2013-06-11 |
| 8304900 | Integrated circuit packaging system with stacked lead and method of manufacture thereof | Ki Youn Jang, Youngjoon KIM | 2012-11-06 |
| 8252615 | Integrated circuit package system employing mold flash prevention technology | Ki Youn Jang, Sungmin Song | 2012-08-28 |
| 8232141 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DaeSik Choi, Junghoon Shin | 2012-07-31 |
| 8129832 | Mountable integrated circuit package system with substrate having a conductor-free recess | Flynn Carson, In Sang Yoon, Seongmin Lee | 2012-03-06 |
| 8039275 | Integrated circuit packaging system with rounded interconnect and method of manufacture thereof | DaeSik Choi, SungWon Cho | 2011-10-18 |
| 7923304 | Integrated circuit packaging system with conductive pillars and method of manufacture thereof | DaeSik Choi, Junghoon Shin | 2011-04-12 |
| 7884457 | Integrated circuit package system with dual side connection | Sungmin Song, SeungYun Ahn | 2011-02-08 |
| 7800212 | Mountable integrated circuit package system with stacking interposer | In Sang Yoon, HanGil Shin | 2010-09-21 |
| 7710735 | Multichip package system | In Sang Yoon | 2010-05-04 |
| 7687897 | Mountable integrated circuit package-in-package system with adhesive spacing structures | Jong-Woo Ha, Seongmin Lee | 2010-03-30 |