Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418332 | Semiconductor device and method of forming partition fence and shielding layer around semiconductor components | Goo Hwa LEE, KyungMoon Kim, SooSan Park | 2019-09-17 |
| 9859200 | Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof | SooSan Park, Kyusang Kim, YeoChan Ko, HeeJo Chi, HeeSoo Lee | 2018-01-02 |
| 9184067 | Methods of mitigating defects for semiconductor packages | Kyunghwan KIM, DeokKyung Yang, SeongHun Mun | 2015-11-10 |
| 9076802 | Dual-sided film-assist molding process | WonJun Ko, GwangTae Kim | 2015-07-07 |