| 9236319 |
Stacked integrated circuit package system |
Jong-Woo Ha, Flynn Carson, Seongmin Lee |
2016-01-12 |
| 8642383 |
Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires |
Jong-Woo Ha |
2014-02-04 |
| 8383458 |
Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof |
DaeSik Choi, Sang Ho Lee, Jong-Woo Ha, Soo-San Park |
2013-02-26 |
| 8093727 |
Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof |
Soo-San Park, Sang Ho Lee, Jong-Woo Ha |
2012-01-10 |
| 8067268 |
Stacked integrated circuit package system and method for manufacturing thereof |
Flynn Carson, Jong-Woo Ha, Seongmin Lee |
2011-11-29 |
| 7872340 |
Integrated circuit package system employing an offset stacked configuration |
DaeSik Choi, Sang Ho Lee, Jong-Woo Ha, Soo-San Park |
2011-01-18 |
| 7812435 |
Integrated circuit package-in-package system with side-by-side and offset stacking |
Soo-San Park, Sang Ho Lee, Jong-Woo Ha |
2010-10-12 |
| 7750454 |
Stacked integrated circuit package system |
Flynn Carson, Jong-Woo Ha, Seongmin Lee |
2010-07-06 |
| 7741154 |
Integrated circuit package system with stacking module |
Jong-Woo Ha, Flynn Carson, Seongmin Lee |
2010-06-22 |
| 7659609 |
Integrated circuit package-in-package system with carrier interposer |
Jong-Woo Ha, Sang Ho Lee, Soo-San Park |
2010-02-09 |