Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8067268 | Stacked integrated circuit package system and method for manufacturing thereof | Jong-Woo Ha, BumJoon Hong, Seongmin Lee | 2011-11-29 |
| 8030756 | Plastic ball grid array package with integral heatsink | TaeKeun Lee, Marcos Karnezos | 2011-10-04 |
| 7829382 | Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package | Marcos Karnezos, Youngcheol Kim | 2010-11-09 |
| 7750454 | Stacked integrated circuit package system | Jong-Woo Ha, BumJoon Hong, Seongmin Lee | 2010-07-06 |
| 7741154 | Integrated circuit package system with stacking module | Jong-Woo Ha, BumJoon Hong, Seongmin Lee | 2010-06-22 |
| 7692279 | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package | Marcos Karnezos, Youngcheol Kim | 2010-04-06 |
| 7687315 | Stacked integrated circuit package system and method of manufacture therefor | — | 2010-03-30 |
| 7494847 | Method for making a semiconductor multi-package module having inverted wire bond carrier second package | Marcos Karnezos | 2009-02-24 |
| 7429786 | Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides | Marcos Karnezos | 2008-09-30 |
| 7354800 | Method of fabricating a stacked integrated circuit package system | — | 2008-04-08 |
| 7253511 | Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package | Marcos Karnezos, Youngcheol Kim | 2007-08-07 |
| 7247519 | Method for making a semiconductor multi-package module having inverted bump chip carrier second package | Marcos Karnezos | 2007-07-24 |
| 7217598 | Method for manufacturing plastic ball grid array package with integral heatsink | TaeKeun Lee, Marcos Karnezos | 2007-05-15 |
| 7053477 | Semiconductor multi-package module having inverted bump chip carrier second package | Marcos Karnezos | 2006-05-30 |
| 6967126 | Method for manufacturing plastic ball grid array with integral heatsink | TaeKeun Lee, Marcos Karnezos | 2005-11-22 |
| 6791169 | Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor | — | 2004-09-14 |
| 6661083 | Plastic semiconductor package | Sang Don Lee, Ki Tae Ryu, Koo Hong Lee | 2003-12-09 |
| 6614123 | Plastic ball grid array package with integral heatsink | TaeKeun Lee, Marcos Karnezos | 2003-09-02 |
| 6468830 | Compliant semiconductor package with anisotropic conductive material interconnects and methods therefor | — | 2002-10-22 |
| 5868301 | Semiconductor inner lead bonding tool | Thomas H. DiStefano | 1999-02-09 |