Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12165956 | Molded silicon on passive package | Kumar Nagarajan, Flynn Carson, Karthik Shanmugam, Raymundo M. Camenforte, Scott D. Morrison | 2024-12-10 | $286,613,000 |
| 12074077 | Flexible package architecture concept in fanout | Karthik Shanmugam, Flynn Carson, Jun Zhai, Raymundo M. Camenforte | 2024-08-27 | $283,265,000 |