Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165956 | Molded silicon on passive package | Kumar Nagarajan, Flynn Carson, Menglu Li, Raymundo M. Camenforte, Scott D. Morrison | 2024-12-10 |
| 12074077 | Flexible package architecture concept in fanout | Flynn Carson, Jun Zhai, Raymundo M. Camenforte, Menglu Li | 2024-08-27 |
| 11532563 | Package integration using fanout cavity substrate | Jun Zhai, Rajasekaran Swaminathan | 2022-12-20 |
| 11515261 | Multiple component integration in fanout package with different back side metallization and thicknesses | Jun Zhai | 2022-11-29 |
| 11395408 | Wafer-level passive array packaging | Scott D. Morrison, Raymundo M. Camenforte, Rakshit Agrawal, Flynn Carson, Kiranjit Dhaliwal | 2022-07-19 |
| 10993317 | Wafer level optical module | Yinjuan He, Peter R. Harper, Tongbi Jiang | 2021-04-27 |
| 10811400 | Wafer level optical module | Yinjuan He, Peter R. Harper, Tongbi Jiang | 2020-10-20 |