Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953917 | Electronics package with embedded through-connect and resistor structure and method of manufacturing thereof | Raymond Albert Fillion, Paul Alan McConnelee | 2018-04-24 |
| 9847236 | Electrical interconnect structure for an embedded electronics package | Paul Alan McConnelee | 2017-12-19 |
| 9806051 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Paul Alan McConnelee, Shakti Singh Chauhan | 2017-10-31 |
| 9704788 | Power overlay structure and method of making same | Paul Alan McConnelee, Shakti Singh Chauhan | 2017-07-11 |
| 9653438 | Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof | Paul Alan McConnelee | 2017-05-16 |
| 9613843 | Power overlay structure having wirebonds and method of manufacturing same | Paul Alan McConnelee | 2017-04-04 |
| 9613932 | Integrated circuit package and method of making same | Paul Alan McConnelee | 2017-04-04 |
| 9570376 | Electrical interconnect for an integrated circuit package and method of making same | Paul Alan McConnelee, Kevin Matthew Durocher, Scott Smith, Donald Paul Cunningham | 2017-02-14 |
| 9391027 | Embedded semiconductor device package and method of manufacturing thereof | Shakti Singh Chauhan, Paul Alan McConnelee | 2016-07-12 |
| 9299630 | Diffusion barrier for surface mount modules | Paul Alan McConnelee, Ri-an Zhao, Shakti Singh Chauhan | 2016-03-29 |
| 9252138 | Interconnect devices for electronic packaging assemblies | Gamal Refai-Ahmed, David Mulford Shaddock, John Anthony Vogel, Christian M. Giovanniello | 2016-02-02 |
| 9209151 | Embedded semiconductor device package and method of manufacturing thereof | Shakti Singh Chauhan, Paul Alan McConnelee | 2015-12-08 |
| 9184124 | Reliable surface mount integrated power module | Shakti Singh Chauhan, Paul Alan McConnelee | 2015-11-10 |
| 9171785 | Power overlay structure with leadframe connections | Paul Alan McConnelee | 2015-10-27 |
| 9165864 | Power overlay structure with leadframe connections | Paul Alan McConnelee | 2015-10-20 |
| 9117813 | Integrated circuit package and method of making same | Paul Alan McConnelee | 2015-08-25 |
| 9066443 | Overlay circuit structure for interconnecting light emitting semiconductors | Donald Paul Cunningham, Shakti Singh Chauhan | 2015-06-23 |
| 8987876 | Power overlay structure and method of making same | Paul Alan McConnelee, Shakti Singh Chauhan | 2015-03-24 |
| 8941208 | Reliable surface mount integrated power module | Shakti Singh Chauhan, Paul Alan McConnelee | 2015-01-27 |
| 8916996 | Electrical distribution system | Marco Francesco Aimi, Jianjun Jiang | 2014-12-23 |
| 8853550 | Circuit board including mask for controlling flow of solder | Kevin Matthew Durocher, James Wilson Rose, Paul Jeffrey Gillespie, Richard Alfred Beaupre, David Richard Esler | 2014-10-07 |
| 8742558 | Component protection for advanced packaging applications | Paul Alan McConnelee, Elizabeth Ann Burke, Kevin Matthew Durocher | 2014-06-03 |
| 8716870 | Direct write interconnections and method of manufacturing thereof | — | 2014-05-06 |
| 8653635 | Power overlay structure with leadframe connections | Paul Alan McConnelee | 2014-02-18 |
| 8586421 | Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance | Richard Alfred Beaupre, Paul Alan McConnelee, Thomas Bert Gorczyca | 2013-11-19 |