Scott Smith — 12 Patents at GE

Scott Smith has been granted 12 US patents while listed as an inventor at GE. The first was granted in 2013 and the most recent in December 2018. Scott Smith ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list Scott Smith in Niskayuna, NY, US.

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10161233	Method of upgrading and recovering a hydrocarbon resource for pipeline transport and related system	Mark E. Blue, Caleb Tomazinis	2018-12-25
10068840	Electrical interconnect for an integrated circuit package and method of making same	Paul Alan McConnelee, Kevin Matthew Durocher, Donald Paul Cunningham	2018-09-04	$17,950,000
9679837	Electrical interconnect for an integrated circuit package and method of making same	Paul Alan McConnelee, Kevin Matthew Durocher, Donald Paul Cunningham	2017-06-13	$20,352,000
9666516	Electronic packages and methods of making and using the same	Christopher James Kapusta, Glenn Forman, Eric Patrick Davis	2017-05-30	$16,936,000
9570376	Electrical interconnect for an integrated circuit package and method of making same	Arun Virupaksha Gowda, Paul Alan McConnelee, Kevin Matthew Durocher, Donald Paul Cunningham	2017-02-14	$21,792,000
9299647	Electrical interconnect for an integrated circuit package and method of making same	Paul Alan McConnelee, Kevin Matthew Durocher, Donald Paul Cunningham	2016-03-29	$26,200,000
9236348	Ultrathin buried die module and method of manufacturing thereof	Paul Alan McConnelee, Elizabeth Ann Burke	2016-01-12	$33,433,000
8829690	System of chip package build-up	Paul Alan McConnelee, Kevin Matthew Durocher, Laura A. Principe	2014-09-09	$13,511,000
8658473	Ultrathin buried die module and method of manufacturing thereof	Paul Alan McConnelee, Elizabeth Ann Burke	2014-02-25	$21,833,000
8653670	Electrical interconnect for an integrated circuit package and method of making same	Paul Alan McConnelee, Kevin Matthew Durocher, Donald Paul Cunningham	2014-02-18	$14,966,000
8623699	Method of chip package build-up	Paul Alan McConnelee, Kevin Matthew Durocher, Laura A. Principe	2014-01-07	$23,149,000
8586172	Protective coating with high adhesion and articles made therewith	Larry Steven Rosenzweig, James Anthony Ruud, Luc Stephane Leblanc, Paul M. Thomas	2013-11-19	$18,552,000

Scott Smith — 12 Patents

Issued Patents All Time

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