AG

Arun Virupaksha Gowda

GE: 63 patents #140 of 36,430Top 1%
📍 Rexford, NY: #5 of 148 inventorsTop 4%
🗺 New York: #1,271 of 115,490 inventorsTop 2%
Overall (All Time): #35,295 of 4,157,543Top 1%
63
Patents All Time

Issued Patents All Time

Showing 51–63 of 63 patents

Patent #TitleCo-InventorsDate
8531027 Press-pack module with power overlay interconnection Ahmed Elasser, Satish Sivarama Gunturi 2013-09-10
8487416 Coaxial power module Eladio Clemente Delgado, Antonio Caiafa, Brian Lynn Rowden, Ljubisa Dragoljub Stevanovic, Richard Alfred Beaupre 2013-07-16
8358000 Double side cooled power module with power overlay Richard Alfred Beaupre, Ljubisa Dragol jub Stevanovic, Stephen Adam Solovitz 2013-01-22
8334593 Semiconductor device package Paul Alan McConnelee 2012-12-18
8310040 Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof Richard Alfred Beaupre, Paul Alan McConnelee, Thomas Bert Gorczyca 2012-11-13
8114712 Method for fabricating a semiconductor device package Paul Alan McConnelee 2012-02-14
8054148 Contact material, device including contact material, and method of making Duraiswamy Srinivasan, Reed Roeder Corderman, Christopher Fred Keimel, Somasundaram Gunasekaran, Sudhakar Eddula Reddy +2 more 2011-11-08
8054589 Switch structure and associated circuit Kathleen Ann O'Brien, John Norton Park, William James Premerlani, Owen Jannis Schelenz, Kanakasabapathi Subramanian 2011-11-08
7919714 System and a method for controlling flow of solder Kevin Matthew Durocher, James Wilson Rose, Paul Jeffrey Gillespie, Richard Alfred Beaupre, David Richard Esler 2011-04-05
7797808 Thermal management system and associated method Jian Zhang, Sandeep Tonapi, Ryan Christopher Mills 2010-09-21
7605466 Sealed wafer packaging of microelectromechanical systems Marco Francesco Aimi, Christopher James Kapusta, David Cecil Hays, Oliver Charles Boomhower, Glenn Scott Claydon +2 more 2009-10-20
7297399 Thermal transport structure and associated method Jian Zhang, Sandeep Tonapi, Ryan Christopher Mills 2007-11-20
7021147 Sensor package and method Kanakasabapathi Subramanian, Donald Joseph Buckley, Slawomir Rubinsztajn, Stanton Earl Weaver, Russell Craddock +1 more 2006-04-04