Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8531027 | Press-pack module with power overlay interconnection | Arun Virupaksha Gowda, Ahmed Elasser | 2013-09-10 |
| 8218320 | Heat sinks with C-shaped manifolds and millichannel cooling | Adam Gregory Pautsch, Patrick Lazatin | 2012-07-10 |
| 8120915 | Integral heat sink with spiral manifolds | Adam Gregory Pautsch, Patrick Lazatin | 2012-02-21 |
| 7817422 | Heat sink and cooling and packaging stack for press-packages | Mahadevan Balasubramaniam, Ramakrishna Venkata Mallina, Richard Alfred Beaupre, Le Yan, Richard S. Zhang +3 more | 2010-10-19 |
| 7538436 | Press pack power semiconductor module | Daniel Schneider | 2009-05-26 |