Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8259454 | Interconnect structure including hybrid frame panel | Donald S. Bitting, Daniel Lee Abraham | 2012-09-04 |
| 8049338 | Power semiconductor module and fabrication method | Eladio Clemente Delgado, Richard Alfred Beaupre, Stephen Daley Arthur, Ernest Wayne Balch, Kevin Matthew Durocher +1 more | 2011-11-01 |
| 8008781 | Apparatus and method for reducing pitch in an integrated circuit | Kevin Matthew Durocher, Richard Joseph Saia, Paul Alan McConnelee | 2011-08-30 |
| 7964974 | Electronic chip package with reduced contact pad pitch | Kevin Matthew Durocher, Richard Joseph Saia, Paul Alan McConnelee | 2011-06-21 |
| 7956457 | System and apparatus for venting electronic packages and method of making same | Kevin Matthew Durocher, Elizabeth Ann Burke, Thomas Bert Gorczyca, Charles G. Woychik | 2011-06-07 |
| 7829386 | Power semiconductor packaging method and structure | Richard Alfred Beaupre, Ahmed Elasser, Robert J. Wojnarowski, Charles Steven Korman | 2010-11-09 |
| 7550097 | Thermal conductive material utilizing electrically conductive nanoparticles | Sandeep Tonapi, Hong Zhong, Davide Louis Simone | 2009-06-23 |
| 7303947 | Source bridge for cooling and/or external connection | Peter N. Bronecke, Joshua Isaac Wright, Jesse Berkley Tucker, Laura Meyer | 2007-12-04 |
| 7262444 | Power semiconductor packaging method and structure | Richard Alfred Beaupre, Ahmed Elasser, Robert J. Wojnarowski, Charles Steven Korman | 2007-08-28 |
| 6933813 | Interconnection structure with etch stop | William Edward Burdick, Jr., James Wilson Rose, Kevin Matthew Durocher | 2005-08-23 |
| 6671948 | Interconnection method using an etch stop | William Edward Burdick, Jr., James Wilson Rose, Kevin Matthew Durocher | 2004-01-06 |
| 6507113 | Electronic interface structures and methods of fabrication | Robert J. Wojnarowski, Ronald Frank Kolc | 2003-01-14 |
| 6396153 | Circuit chip package and fabrication method | Ernest Wayne Balch, Ronald Frank Kolc, William Edward Burdick, Jr., Robert J. Wojnarowski, Leonard Richard Douglas +1 more | 2002-05-28 |
| 6306680 | Power overlay chip scale packages for discrete power devices | Barry Scott Whitmore, Charles Steven Korman, Albert Andreas Maria Esser | 2001-10-23 |
| 6242282 | Circuit chip package and fabrication method | Ernest Wayne Balch, Ronald Frank Kolc, William Edward Burdick, Jr., Robert J. Wojnarowski, Leonard Richard Douglas +1 more | 2001-06-05 |
| 6239980 | Multimodule interconnect structure and process | Wolfgang Daum, Ronald Frank Kolc, Donald W. Kuk, Rob Ert John Wojnarowski | 2001-05-29 |
| 6239482 | Integrated circuit package including window frame | William Edward Burdick, Jr., Ronald Frank Kolc, James Wilson Rose, Glenn Scott Claydon | 2001-05-29 |
| 5946546 | Chip burn-in and test structure and method | William Edward Burdick, Jr. | 1999-08-31 |
| 5888837 | Chip burn-in and test structure and method | William Edward Burdick, Jr. | 1999-03-30 |
| 5703440 | Compact fluorescent lamp and ballast arrangement with inductor directly between lamp ends | David J. Kachmarik, Thomas F. Soules, Erwin G. Steinbrenner, Donald W. Kuk | 1997-12-30 |
| 5691598 | Fluorescent lamp with thermal heat shield between lamp tube and ballast circuitry | Kelvin B. Belle, Leon F. Chamberlain, Jozsef Fulop, David J. Kachmarik, Donald W. Kuk +3 more | 1997-11-25 |
| 5637922 | Wireless radio frequency power semiconductor devices using high density interconnect | Otward M. Mueller, James F. Burgess | 1997-06-10 |
| 5532512 | Direct stacked and flip chip power semiconductor device structures | Eric J. Wildi, Charles Steven Korman, Sayed-Amr El-Hamamsy, Steven M. Gasworth, Michael W. DeVre +1 more | 1996-07-02 |
| 5527741 | Fabrication and structures of circuit modules with flexible interconnect layers | Herbert S. Cole, Jr., Bernard Gorowitz, Ronald Frank Kolc, Robert J. Wojnarowski | 1996-06-18 |
| 5497033 | Embedded substrate for integrated circuit modules | Robert J. Woinarowski, Michael Gdula, Herbert S. Cole, Jr., Eric J. Wildi, Wolfgang Daum | 1996-03-05 |