Issued Patents All Time
Showing 25 most recent of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7011983 | Large organic devices and methods of fabricating large organic devices | Donald Franklin Foust, Anil Raj Duggal, Richard Joseph Saia | 2006-03-14 |
| 6770885 | Systems and methods for detecting ionizing radiation with an imaging system | Jeffrey Wayne Eberhard, Robert F. Kwasnick, Theresa Ann Sitnik-Nieters | 2004-08-03 |
| 6733711 | Plastic packaging of LED arrays | Kevin Matthew Durocher, Ernest Wayne Balch, Vikram Krishnamurthy, Richard Joseph Saia, Ronald Frank Kolc | 2004-05-11 |
| 6730533 | Plastic packaging of LED arrays | Kevin Matthew Durocher, Ernest Wayne Balch, Vikram Krishnamurthy, Richard Joseph Saia, Ronald Frank Kolc | 2004-05-04 |
| 6614103 | Plastic packaging of LED arrays | Kevin Matthew Durocher, Ernest Wayne Balch, Vikram Krishnamurthy, Richard Joseph Saia, Ronald Frank Kolc | 2003-09-02 |
| 6548189 | Epoxy adhesive | Somasundaram Gunasekaran, Thomas Bert Gorczyca | 2003-04-15 |
| 6362722 | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite | Theresa Ann Sitnik-Nieters, Anil Raj Duggal | 2002-03-26 |
| 6323096 | Method for fabricating a flexible interconnect film with resistor and capacitor layers | Richard Joseph Saia, Kevin Matthew Durocher | 2001-11-27 |
| 6297459 | Processing low dielectric constant materials for high speed electronics | Robert J. Wojnarowski, Theresa Ann Sitnik-Nieters, Wolfgang Daum | 2001-10-02 |
| 6294741 | Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesive | Theresa Ann Sitnik-Nieters | 2001-09-25 |
| 6255137 | Method for making air pockets in an HDI context | Thomas Bert Gorczyca | 2001-07-03 |
| 6252304 | Metallized vias with and method of fabrication | Wolfgang Daum | 2001-06-26 |
| 6191681 | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite | Theresa Ann Sitnik-Nieters, Anil Raj Duggal | 2001-02-20 |
| 5897728 | Integrated circuit test structure and test process | James Wilson Rose, Robert J. Wojnarowski, Charles W. Eichelberger | 1999-04-27 |
| 5897368 | Method of fabricating metallized vias with steep walls | Wolfgang Daum | 1999-04-27 |
| 5874770 | Flexible interconnect film including resistor and capacitor layers | Richard Joseph Saia, Kevin Matthew Durocher | 1999-02-23 |
| 5785787 | Processing low dielectric constant materials for high speed electronics | Robert J. Wojnarowski, Theresa Ann Sitnik-Nieters, Wolfgang Daum | 1998-07-28 |
| 5745984 | Method for making an electronic module | Theresa Ann Sitnik-Nieters | 1998-05-05 |
| 5737458 | Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography | Robert J. Wojnarowski, John L. Henkes | 1998-04-07 |
| 5576517 | Low Dielectric constant materials for high speed electronics | Robert J. Wojnarowski, Theresa Ann Sitnik-Nieters, Wolfgang Daum | 1996-11-19 |
| 5562838 | Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography | Robert J. Wojnarowski, John L. Henkes | 1996-10-08 |
| 5554305 | Processing low dielectric constant materials for high speed electronics | Robert J. Wojnarowski, Theresa Ann Sitnik-Nieters, Wolfgang Daum | 1996-09-10 |
| 5548099 | Method for making an electronics module having air bridge protection without large area ablation | Theresa Ann Sitnik-Nieters | 1996-08-20 |
| 5534602 | High temperature polyether imide compositions and method for making | John H. Lupinski | 1996-07-09 |
| 5527741 | Fabrication and structures of circuit modules with flexible interconnect layers | Raymond Albert Fillion, Bernard Gorowitz, Ronald Frank Kolc, Robert J. Wojnarowski | 1996-06-18 |