Issued Patents All Time
Showing 25 most recent of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8590145 | Method of fabricating a circuit structure | James E. Kohl | 2013-11-26 |
| 8564119 | Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | James E. Kohl | 2013-10-22 |
| 8533941 | Method of bonding two structures together with an adhesive line of controlled thickness | James E. Kohl | 2013-09-17 |
| 8474133 | Method of fabricating a base layer circuit structure | James E. Kohl | 2013-07-02 |
| 8384199 | Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | James E. Kohl | 2013-02-26 |
| 8324020 | Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | James E. Kohl | 2012-12-04 |
| 8169065 | Stackable circuit structures and methods of fabrication thereof | James E. Kohl | 2012-05-01 |
| 7868445 | Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer | James E. Kohl | 2011-01-11 |
| 7863090 | Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system | James E. Kohl | 2011-01-04 |
| 7830000 | Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | James E. Kohl | 2010-11-09 |
| 7619901 | Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system | James E. Kohl | 2009-11-17 |
| 7112467 | Structure and method for temporarily holding integrated circuit chips in accurate alignment | Paul V. Starenas | 2006-09-26 |
| 6818544 | Compliant, solderable input/output bump structures | James E. Kohl | 2004-11-16 |
| 6555908 | Compliant, solderable input/output bump structures | James E. Kohl | 2003-04-29 |
| 6426545 | Integrated circuit structures and methods employing a low modulus high elongation photodielectric | James E. Kohl | 2002-07-30 |
| 6396148 | Electroless metal connection structures and methods | James E. Kohl, Michael Rickley | 2002-05-28 |
| 6159767 | Single chip modules, repairable multichip modules, and methods of fabrication thereof | — | 2000-12-12 |
| 5897728 | Integrated circuit test structure and test process | Herbert S. Cole, Jr., James Wilson Rose, Robert J. Wojnarowski | 1999-04-27 |
| 5841193 | Single chip modules, repairable multichip modules, and methods of fabrication thereof | — | 1998-11-24 |
| 5452182 | Flexible high density interconnect structure and flexibly interconnected system | William P. Kornrumpf, Robert J. Wojnarowski | 1995-09-19 |
| 5359496 | Hermetic high density interconnected electronic system | William P. Kornrumpf, Robert J. Wojnarowski | 1994-10-25 |
| 5355102 | HDI impedance matched microwave circuit assembly | William P. Kornrumpf, Robert J. Wojnarowski | 1994-10-11 |
| 5348607 | High density interconnect thermoplastic die attach material and solvent die attach processing | Robert J. Wojnarowski | 1994-09-20 |
| 5331203 | High density interconnect structure including a chamber | Robert J. Wojnarowski, William P. Kornrumpf | 1994-07-19 |
| 5258647 | Electronic systems disposed in a high force environment | Robert J. Wojnarowski | 1993-11-02 |