Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8590145 | Method of fabricating a circuit structure | Charles W. Eichelberger | 2013-11-26 |
| 8564119 | Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | Charles W. Eichelberger | 2013-10-22 |
| 8533941 | Method of bonding two structures together with an adhesive line of controlled thickness | Charles W. Eichelberger | 2013-09-17 |
| 8474133 | Method of fabricating a base layer circuit structure | Charles W. Eichelberger | 2013-07-02 |
| 8384199 | Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | Charles W. Eichelberger | 2013-02-26 |
| 8324020 | Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | Charles W. Eichelberger | 2012-12-04 |
| 8169065 | Stackable circuit structures and methods of fabrication thereof | Charles W. Eichelberger | 2012-05-01 |
| 7868445 | Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer | Charles W. Eichelberger | 2011-01-11 |
| 7863090 | Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system | Charles W. Eichelberger | 2011-01-04 |
| 7830000 | Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system | Charles W. Eichelberger | 2010-11-09 |
| 7619901 | Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system | Charles W. Eichelberger | 2009-11-17 |
| 6818544 | Compliant, solderable input/output bump structures | Charles W. Eichelberger | 2004-11-16 |
| 6555908 | Compliant, solderable input/output bump structures | Charles W. Eichelberger | 2003-04-29 |
| 6426545 | Integrated circuit structures and methods employing a low modulus high elongation photodielectric | Charles W. Eichelberger | 2002-07-30 |
| 6396148 | Electroless metal connection structures and methods | Charles W. Eichelberger, Michael Rickley | 2002-05-28 |
| 5093600 | Piezo-electric relay | — | 1992-03-03 |
| 4982262 | Inverted groove isolation technique for merging dielectrically isolated semiconductor devices | Adrian R. Hartman, Robert S. Scott, Harry T. Weston | 1991-01-01 |
| 4897153 | Method of processing siloxane-polyimides for electronic packaging applications | Herbert S. Cole | 1990-01-30 |
| 4868620 | High-voltage pull-up device | Eric J. Wildi, Robert S. Scott, Deva N. Pattanaya, Michael Adler | 1989-09-19 |
| 4860334 | System for detecting and locating defective crosspoint switches | Donald L. Watrous | 1989-08-22 |
| 4795917 | Low power high voltage driver circuit | Robert S. Scott | 1989-01-03 |
| 4742263 | Piezoelectric switch | John D. Harnden, Jr., William P. Kornrumpf, Michael Adler | 1988-05-03 |
| 4697118 | Piezoelectric switch | John D. Harnden, Jr., William P. Kornrumpf, Michael Adler | 1987-09-29 |
| 4661838 | High voltage semiconductor devices electrically isolated from an integrated circuit substrate | Eric J. Wildi | 1987-04-28 |
| H40 | Field shields for Schottky barrier devices | William L. Buchanan, Robert S. Scott, Yiu-Huen Wong | 1986-04-01 |