EW

Eric J. Wildi

GE: 9 patents #3,747 of 36,430Top 15%
EE Emerson Electric: 6 patents #183 of 1,374Top 15%
RA Rockwell Automation: 5 patents #516 of 1,986Top 30%
LM Lockheed Martin: 4 patents #782 of 6,507Top 15%
MA Magnemotion: 1 patents #9 of 21Top 45%
PB Pacific Bell: 1 patents #17 of 38Top 45%
Overall (All Time): #153,399 of 4,157,543Top 4%
26
Patents All Time

Issued Patents All Time

Showing 25 most recent of 26 patents

Patent #TitleCo-InventorsDate
11307067 System and method for automatic runtime position sensor offset calibration in a linear motion system Yuhong Huang, Brian M. Perreault 2022-04-19
10914620 System and method for automatic runtime position sensor gain calibration in a linear motion system Yuhong Huang, Brian M. Perreault 2021-02-09
10717365 System and method for limiting motion in an independent cart system Yuhong Huang, Oliver C. Haya, Neil R. Bentley, Robert H. Schmidt 2020-07-21
10720864 System and method for monitoring mover status in an independent cart system Yuhong Huang, Oliver C. Haya, Neil R. Bentley, Robert H. Schmidt 2020-07-21
10442637 Linear drive system having central, distributed and group control Yuhong Huang, Brian M. Perreault, Mark R. Cooper, Robert H. Schmidt 2019-10-15
10432117 System and method for monitoring mover status in an independent cart system Yuhong Huang, Oliver C. Haya, Neil R. Bentley, Robert H. Schmidt 2019-10-01
8855474 Inhibiting compressor backspin via a condenser motor Joseph G. Marcinkiewicz, Mark E. Carrier 2014-10-07
8400090 HVAC condenser assemblies having controllable input voltages Joseph G. Marcinkiewicz, Mark E. Carrier 2013-03-19
8346507 System and method for detecting fluid delivery system conditions based on motor parameters Prakash B. Shahi, Mark E. Carrier, Randy L. Bomkamp, Hung M. Pham, William P. Butler 2013-01-01
7941294 System and method for detecting fluid delivery system conditions based on motor parameters Prakash B. Shahi, Mark E. Carrier, Randy L. Bomkamp, Hung M. Pham, William P. Butler 2011-05-10
6392419 Apparatus for and method of monitoring the status of the insulation on the wire in a winding Vojislav Divljakovic 2002-05-21
6233149 High power inverter air cooling Ronald B. Bailey, Vinod Kumar Singh, Wayne A. Kennedy 2001-05-15
6087836 Apparatus for and method of monitoring the status of the insulation on the wire in a winding Vojislav Divljakovic 2000-07-11
5776275 Fabrication of compact magnetic circulator components in microwave packages using high density interconnections Vikram Krishnamurthy, Kyung Wook Paik, Mario Ghezzo, William P. Kornrumpf 1998-07-07
5653841 Fabrication of compact magnetic circulator components in microwave packages using high density interconnections Vikram Krishnamurthy, Kyung Wook Paik, Mario Ghezzo, William P. Kornrumpf 1997-08-05
5532512 Direct stacked and flip chip power semiconductor device structures Raymond Albert Fillion, Charles Steven Korman, Sayed-Amr El-Hamamsy, Steven M. Gasworth, Michael W. DeVre +1 more 1996-07-02
5497033 Embedded substrate for integrated circuit modules Raymond Albert Fillion, Robert J. Woinarowski, Michael Gdula, Herbert S. Cole, Jr., Wolfgang Daum 1996-03-05
5366906 Wafer level integration and testing Robert J. Wojnarowski, Constantine A. Neugebauer, Wolfgang Daum, Bernard Gorowitz, Michael Gdula +2 more 1994-11-22
5353498 Method for fabricating an integrated circuit module Raymond Albert Fillion, Robert J. Wojnarowski, Michael Gdula, Herbert S. Cole, Jr., Wolfgang Daum 1994-10-11
4942440 High voltage semiconductor devices with reduced on-resistance Bantval J. Baliga 1990-07-17
4868620 High-voltage pull-up device James E. Kohl, Robert S. Scott, Deva N. Pattanaya, Michael Adler 1989-09-19
4862242 Semiconductor wafer with an electrically-isolated semiconductor device Tat-Sing P. Chow 1989-08-29
4783690 Power semiconductor device with main current section and emulation current section John P. Walden 1988-11-08
4777579 Integrated current sensor configurations for AC motor drives Thomas Merlin Jahns 1988-10-11
4661838 High voltage semiconductor devices electrically isolated from an integrated circuit substrate James E. Kohl 1987-04-28