Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5418002 | Direct bonding of copper to aluminum nitride substrates | Kyung Wook Paik | 1995-05-23 |
| 5384691 | High density interconnect multi-chip modules including embedded distributed power supply elements | Charles Steven Korman, David Bates, William Hull Bicknell, Wolfgang Daum | 1995-01-24 |
| 5366906 | Wafer level integration and testing | Robert J. Wojnarowski, Wolfgang Daum, Bernard Gorowitz, Eric J. Wildi, Michael Gdula +2 more | 1994-11-22 |
| 5336928 | Hermetically sealed packaged electronic system | Robert J. Wojnarowski | 1994-08-09 |
| 5304847 | Direct thermocompression bonding for thin electronic power chips | Homer H. Glascock, II, Kyung Wook Paik, James G. McMullen | 1994-04-19 |
| 5293070 | Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules | James F. Burgess, Wivina A. A. Rik DeDoncker, Donald W. Jones | 1994-03-08 |
| 5291066 | Moisture-proof electrical circuit high density interconnect module and method for making same | Herbert S. Cole, Eugene L. Bartels, Raymond Albert Fillion | 1994-03-01 |
| 5209390 | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid | Victor A. K. Temple, Donald L. Watrous, James F. Burgess, Homer H. Glascock, II | 1993-05-11 |
| 5206186 | Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding | Homer H. Glascock, II, Kyung Wook Paik, James G. McMullen | 1993-04-27 |
| 5184206 | Direct thermocompression bonding for thin electronic power chips | Homer H. Glascock, II, Kyung Wook Paik, James G. McMullen, Martha M. Neugebauer | 1993-02-02 |
| 5166773 | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid | Victor A. K. Temple, Donald L. Watrous, James F. Burgess, Homer H. Glascock, II | 1992-11-24 |
| 5139972 | Batch assembly of high density hermetic packages for power semiconductor chips | Victor A. K. Temple | 1992-08-18 |
| 5135890 | Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip | Victor A. K. Temple, Donald L. Watrous, James F. Burgess, Homer H. Glascock, II | 1992-08-04 |
| 5105536 | Method of packaging a semiconductor chip in a low inductance package | Robert J. Satriano, James F. Burgess, Homer H. Glascock, II, Victor A. K. Temple, Donald L. Watrous | 1992-04-21 |
| 5103290 | Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip | Victor A. K. Temple, Donald L. Watrous, James F. Burgess, Homer H. Glascock, II | 1992-04-07 |
| 5100740 | Direct bonded symmetric-metallic-laminate/substrate structures | James F. Burgess, Homer H. Glascock, II | 1992-03-31 |
| 5043859 | Half bridge device package, packaged devices and circuits | Charles Steven Korman, Alexander J. Yerman, Sayed-Amr El-Hamamsy | 1991-08-27 |
| 5028987 | High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip | Robert J. Satriano, James F. Burgess, Homer H. Glascock, II, Victor A. K. Temple, Donald L. Watrous | 1991-07-02 |
| 5018002 | High current hermetic package including an internal foil and having a lead extending through the package lid and a packaged semiconductor chip | Wolfgang Daum | 1991-05-21 |
| 4996116 | Enhanced direct bond structure | Harold F. Webster, James F. Burgess | 1991-02-26 |
| 4901136 | Multi-chip interconnection package | Lionel M. Levinson, Homer H. Glascock, II, Charles W. Eichelberger, Robert J. Wojnarowski, Richard O. Carlson | 1990-02-13 |
| 4816422 | Fabrication of large power semiconductor composite by wafer interconnection of individual devices | Alexander J. Yerman | 1989-03-28 |
| 4803450 | Multilayer circuit board fabricated from silicon | James F. Burgess, Homer H. Glascock, II, Harold F. Webster, James A. Loughran | 1989-02-07 |
| 4774632 | Hybrid integrated circuit chip package | — | 1988-09-27 |
| 4769744 | Semiconductor chip packages having solder layers of enhanced durability | Richard O. Carlson | 1988-09-06 |