Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6622739 | Method and apparatus for removal of coatings and oxidation from transit vehicles | Robert M. Rice, Kirk E. McLauchlin | 2003-09-23 |
| 6136379 | Method for applying metal-filled solventless resin coating | Jack G. Scarpa, John D. Marlin, Matthew M. Kelly, Anthony Howard | 2000-10-24 |
| 5964418 | Spray nozzle for applying metal-filled solventless resin coating and method | Jack G. Scarpa, John D. Marlin, Matthew M. Kelly, Anthony Howard | 1999-10-12 |
| 5637922 | Wireless radio frequency power semiconductor devices using high density interconnect | Raymond Albert Fillion, Otward M. Mueller | 1997-06-10 |
| 5532512 | Direct stacked and flip chip power semiconductor device structures | Raymond Albert Fillion, Eric J. Wildi, Charles Steven Korman, Sayed-Amr El-Hamamsy, Steven M. Gasworth +1 more | 1996-07-02 |
| 5324987 | Electronic apparatus with improved thermal expansion match | Charles D. Iacovangelo, Raymond Albert Fillion | 1994-06-28 |
| 5293070 | Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules | Wivina A. A. Rik DeDoncker, Donald W. Jones, Constantine A. Neugebauer | 1994-03-08 |
| 5209390 | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid | Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, Homer H. Glascock, II | 1993-05-11 |
| 5166773 | Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid | Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, Homer H. Glascock, II | 1992-11-24 |
| 5135890 | Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip | Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, Homer H. Glascock, II | 1992-08-04 |
| 5105536 | Method of packaging a semiconductor chip in a low inductance package | Constantine A. Neugebauer, Robert J. Satriano, Homer H. Glascock, II, Victor A. K. Temple, Donald L. Watrous | 1992-04-21 |
| 5103290 | Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip | Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, Homer H. Glascock, II | 1992-04-07 |
| 5100740 | Direct bonded symmetric-metallic-laminate/substrate structures | Constantine A. Neugebauer, Homer H. Glascock, II | 1992-03-31 |
| 5028987 | High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip | Constantine A. Neugebauer, Robert J. Satriano, Homer H. Glascock, II, Victor A. K. Temple, Donald L. Watrous | 1991-07-02 |
| 4996116 | Enhanced direct bond structure | Harold F. Webster, Constantine A. Neugebauer | 1991-02-26 |
| 4803450 | Multilayer circuit board fabricated from silicon | Homer H. Glascock, II, Harold F. Webster, Constantine A. Neugebauer, James A. Loughran | 1989-02-07 |
| 4711804 | Circuit board construction | — | 1987-12-08 |