Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7281946 | Hermetically sealed ceramic package | Dino Nicoletta | 2007-10-16 |
| 5148264 | High current hermetic package | — | 1992-09-15 |
| 5105536 | Method of packaging a semiconductor chip in a low inductance package | Constantine A. Neugebauer, James F. Burgess, Homer H. Glascock, II, Victor A. K. Temple, Donald L. Watrous | 1992-04-21 |
| 5097319 | Cover with through terminals for a hermetically sealed electronic package | — | 1992-03-17 |
| 5049973 | Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s) | Thomas McLean | 1991-09-17 |
| 5038197 | Hermetically sealed die package with floating source | — | 1991-08-06 |
| 5028987 | High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip | Constantine A. Neugebauer, James F. Burgess, Homer H. Glascock, II, Victor A. K. Temple, Donald L. Watrous | 1991-07-02 |