| 4803450 |
Multilayer circuit board fabricated from silicon |
James F. Burgess, Homer H. Glascock, II, Harold F. Webster, Constantine A. Neugebauer |
1989-02-07 |
| 4764485 |
Method for producing via holes in polymer dielectrics |
James G. McMullen, Alexander J. Yerman |
1988-08-16 |
| 4750666 |
Method of fabricating gold bumps on IC's and power chips |
Constantine A. Neugebauer |
1988-06-14 |
| 4720308 |
Method for producing high-aspect ratio hollow diffused regions in a semiconductor body and diode produced thereby |
Thomas R. Anthony, Douglas E. Houston |
1988-01-19 |
| 4716124 |
Tape automated manufacture of power semiconductor devices |
Alexander J. Yerman |
1987-12-29 |
| 4635092 |
Tape automated manufacture of power semiconductor devices |
Alexander J. Yerman |
1987-01-06 |
| 4595428 |
Method for producing high-aspect ratio hollow diffused regions in a semiconductor body |
Thomas R. Anthony, Douglas E. Houston |
1986-06-17 |
| 4570173 |
High-aspect-ratio hollow diffused regions in a semiconductor body |
Thomas R. Anthony, Douglas E. Houston |
1986-02-11 |
| 4541035 |
Low loss, multilevel silicon circuit board |
Richard O. Carlson, Homer H. Glascock, II, Harold F. Webster |
1985-09-10 |
| 4527183 |
Drilled, diffused radiation detector |
Thomas R. Anthony, Douglas E. Houston |
1985-07-02 |
| 4204628 |
Method for thermo-compression diffusion bonding |
Douglas E. Houston |
1980-05-27 |
