| 4720308 |
Method for producing high-aspect ratio hollow diffused regions in a semiconductor body and diode produced thereby |
Thomas R. Anthony, James A. Loughran |
1988-01-19 |
| 4595428 |
Method for producing high-aspect ratio hollow diffused regions in a semiconductor body |
Thomas R. Anthony, James A. Loughran |
1986-06-17 |
| 4570173 |
High-aspect-ratio hollow diffused regions in a semiconductor body |
Thomas R. Anthony, James A. Loughran |
1986-02-11 |
| 4527183 |
Drilled, diffused radiation detector |
Thomas R. Anthony, James A. Loughran |
1985-07-02 |
| 4392153 |
Cooled semiconductor power module including structured strain buffers without dry interfaces |
Homer H. Glascock, II, Michael H. McLaughlin, Harold F. Webster |
1983-07-05 |
| 4385310 |
Structured copper strain buffer |
— |
1983-05-24 |
| 4315591 |
Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer |
— |
1982-02-16 |
| 4257156 |
Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers |
— |
1981-03-24 |
| 4252263 |
Method and apparatus for thermo-compression diffusion bonding |
— |
1981-02-24 |
| 4204628 |
Method for thermo-compression diffusion bonding |
James A. Loughran |
1980-05-27 |
| 4198247 |
Sealant films for materials having high intrinsic vapor pressure |
Thomas R. Anthony, Harvey E. Cline |
1980-04-15 |