Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5184206 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Homer H. Glascock, II, Kyung Wook Paik, James G. McMullen | 1993-02-02 |