| 6298551 |
Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas |
Robert J. Wojnarowski, Barry Scott Whitmore |
2001-10-09 |
$100,290,000 |
| 6046410 |
Interface structures for electronic devices |
Robert J. Wojnarowski, Barry Scott Whitmore |
2000-04-04 |
$301,769,000 |
| 5973908 |
Structure for thin film capacitors |
Richard Joseph Saia, Kevin Matthew Durocher |
1999-10-26 |
$130,177,000 |
| 5857858 |
Demountable and repairable low pitch interconnect for stacked multichip modules |
Robert J. Wojnarowski, Ronald Frank Kolc |
1999-01-12 |
$73,694,000 |
| 5757072 |
Structure for protecting air bridges on semiconductor chips from damage |
Charles Becker, Renato Guida, Thomas Bert Gorczyca, James Wilson Rose |
1998-05-26 |
|
| 5736448 |
Fabrication method for thin film capacitors |
Richard Joseph Saia, Kevin Matthew Durocher |
1998-04-07 |
$70,973,000 |
| 5699234 |
Stacking of three dimensional high density interconnect modules with metal edge contacts |
Richard Joseph Saia, Kevin Matthew Durocher |
1997-12-16 |
$69,479,000 |
| 5657537 |
Method for fabricating a stack of two dimensional circuit modules |
Richard Joseph Saia, Kevin Matthew Durocher |
1997-08-19 |
$53,331,000 |
| 5576925 |
Flexible multilayer thin film capacitors |
Paul Alan McConnelee, Michael W. DeVre, Stefan J. Rzad, Ernest W. Litch, III |
1996-11-19 |
$29,765,000 |
| 5561085 |
Structure for protecting air bridges on semiconductor chips from damage |
Charles Becker, Renato Guida, Thomas Bert Gorczyca, James Wilson Rose |
1996-10-01 |
|
| 5527741 |
Fabrication and structures of circuit modules with flexible interconnect layers |
Herbert S. Cole, Jr., Raymond Albert Fillion, Ronald Frank Kolc, Robert J. Wojnarowski |
1996-06-18 |
|
| 5524339 |
Method for protecting gallium arsenide mmic air bridge structures |
Richard Joseph Saia, Kevin Matthew Durocher |
1996-06-11 |
|
| 5401687 |
Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures |
Herbert S. Cole, Jr., Theresa Ann Sitnik-Nieters |
1995-03-28 |
|
| 5391516 |
Method for enhancement of semiconductor device contact pads |
Robert J. Wojnarowski |
1995-02-21 |
$9,107,000 |
| 5366906 |
Wafer level integration and testing |
Robert J. Wojnarowski, Constantine A. Neugebauer, Wolfgang Daum, Eric J. Wildi, Michael Gdula +2 more |
1994-11-22 |
$5,921,000 |
| 5303684 |
Combustion control for producing low NO.sub.x emissions through use of flame spectroscopy |
Dale M. Brown |
1994-04-19 |
$16,413,000 |
| 5279706 |
Method and apparatus for fabricating a metal interconnection pattern for an integrated circuit module |
Ernest Wayne Balch, Stanton Earl Weaver, William H. King |
1994-01-18 |
$18,622,000 |
| 5257496 |
Combustion control for producing low NO.sub.x emissions through use of flame spectroscopy |
Dale M. Brown |
1993-11-02 |
$10,431,000 |
| 4998151 |
Power field effect devices having small cell size and low contact resistance |
Charles Steven Korman, Krishna Shenai, Bantval J. Baliga, Patricia A. Piacente, Tat-Sing P. Chow +1 more |
1991-03-05 |
$15,927,000 |
| 4933742 |
Metallization contact system for large scale integrated circuits |
Dale M. Brown, Ronald H. Wilson |
1990-06-12 |
$8,444,000 |
| 4871617 |
Ohmic contacts and interconnects to silicon and method of making same |
Manjin J. Kim, Dale M. Brown, Simon S. Cohen, Richard Joseph Saia |
1989-10-03 |
$10,849,000 |
| 4845050 |
Method of making mo/tiw or w/tiw ohmic contacts to silicon |
Manjin J. Kim, Dale M. Brown, Simon S. Cohen, Richard Joseph Saia |
1989-07-04 |
|
| 4824802 |
Method of filling interlevel dielectric via or contact holes in multilevel VLSI metallization structures |
Dale M. Brown, Richard Joseph Saia |
1989-04-25 |
$7,079,000 |
| 4522681 |
Method for tapered dry etching |
Richard Joseph Saia |
1985-06-11 |
$3,400,000 |
| 4444618 |
Processes and gas mixtures for the reactive ion etching of aluminum and aluminum alloys |
Richard Joseph Saia |
1984-04-24 |
$10,857,000 |
