Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6298551 | Methods of forming compliant interface structures with partially open interiors for coupling two electrically conductive contact areas | Robert J. Wojnarowski, Barry Scott Whitmore | 2001-10-09 |
| 6046410 | Interface structures for electronic devices | Robert J. Wojnarowski, Barry Scott Whitmore | 2000-04-04 |
| 5973908 | Structure for thin film capacitors | Richard Joseph Saia, Kevin Matthew Durocher | 1999-10-26 |
| 5857858 | Demountable and repairable low pitch interconnect for stacked multichip modules | Robert J. Wojnarowski, Ronald Frank Kolc | 1999-01-12 |
| 5757072 | Structure for protecting air bridges on semiconductor chips from damage | Charles Becker, Renato Guida, Thomas Bert Gorczyca, James Wilson Rose | 1998-05-26 |
| 5736448 | Fabrication method for thin film capacitors | Richard Joseph Saia, Kevin Matthew Durocher | 1998-04-07 |
| 5699234 | Stacking of three dimensional high density interconnect modules with metal edge contacts | Richard Joseph Saia, Kevin Matthew Durocher | 1997-12-16 |
| 5657537 | Method for fabricating a stack of two dimensional circuit modules | Richard Joseph Saia, Kevin Matthew Durocher | 1997-08-19 |
| 5576925 | Flexible multilayer thin film capacitors | Paul Alan McConnelee, Michael W. DeVre, Stefan J. Rzad, Ernest W. Litch, III | 1996-11-19 |
| 5561085 | Structure for protecting air bridges on semiconductor chips from damage | Charles Becker, Renato Guida, Thomas Bert Gorczyca, James Wilson Rose | 1996-10-01 |
| 5527741 | Fabrication and structures of circuit modules with flexible interconnect layers | Herbert S. Cole, Jr., Raymond Albert Fillion, Ronald Frank Kolc, Robert J. Wojnarowski | 1996-06-18 |
| 5524339 | Method for protecting gallium arsenide mmic air bridge structures | Richard Joseph Saia, Kevin Matthew Durocher | 1996-06-11 |
| 5401687 | Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures | Herbert S. Cole, Jr., Theresa Ann Sitnik-Nieters | 1995-03-28 |
| 5391516 | Method for enhancement of semiconductor device contact pads | Robert J. Wojnarowski | 1995-02-21 |
| 5366906 | Wafer level integration and testing | Robert J. Wojnarowski, Constantine A. Neugebauer, Wolfgang Daum, Eric J. Wildi, Michael Gdula +2 more | 1994-11-22 |
| 5303684 | Combustion control for producing low NO.sub.x emissions through use of flame spectroscopy | Dale M. Brown | 1994-04-19 |
| 5279706 | Method and apparatus for fabricating a metal interconnection pattern for an integrated circuit module | Ernest Wayne Balch, Stanton Earl Weaver, William H. King | 1994-01-18 |
| 5257496 | Combustion control for producing low NO.sub.x emissions through use of flame spectroscopy | Dale M. Brown | 1993-11-02 |
| 4998151 | Power field effect devices having small cell size and low contact resistance | Charles Steven Korman, Krishna Shenai, Bantval J. Baliga, Patricia A. Piacente, Tat-Sing P. Chow +1 more | 1991-03-05 |
| 4933742 | Metallization contact system for large scale integrated circuits | Dale M. Brown, Ronald H. Wilson | 1990-06-12 |
| 4871617 | Ohmic contacts and interconnects to silicon and method of making same | Manjin J. Kim, Dale M. Brown, Simon S. Cohen, Richard Joseph Saia | 1989-10-03 |
| 4845050 | Method of making mo/tiw or w/tiw ohmic contacts to silicon | Manjin J. Kim, Dale M. Brown, Simon S. Cohen, Richard Joseph Saia | 1989-07-04 |
| 4824802 | Method of filling interlevel dielectric via or contact holes in multilevel VLSI metallization structures | Dale M. Brown, Richard Joseph Saia | 1989-04-25 |
| 4522681 | Method for tapered dry etching | Richard Joseph Saia | 1985-06-11 |
| 4444618 | Processes and gas mixtures for the reactive ion etching of aluminum and aluminum alloys | Richard Joseph Saia | 1984-04-24 |