Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6770885 | Systems and methods for detecting ionizing radiation with an imaging system | Jeffrey Wayne Eberhard, Herbert S. Cole, Jr., Robert F. Kwasnick | 2004-08-03 |
| 6362722 | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite | Herbert S. Cole, Jr., Anil Raj Duggal | 2002-03-26 |
| 6297459 | Processing low dielectric constant materials for high speed electronics | Robert J. Wojnarowski, Herbert S. Cole, Jr., Wolfgang Daum | 2001-10-02 |
| 6294741 | Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesive | Herbert S. Cole, Jr. | 2001-09-25 |
| 6191681 | Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite | Herbert S. Cole, Jr., Anil Raj Duggal | 2001-02-20 |
| 5785787 | Processing low dielectric constant materials for high speed electronics | Robert J. Wojnarowski, Herbert S. Cole, Jr., Wolfgang Daum | 1998-07-28 |
| 5745984 | Method for making an electronic module | Herbert S. Cole, Jr. | 1998-05-05 |
| 5576517 | Low Dielectric constant materials for high speed electronics | Robert J. Wojnarowski, Herbert S. Cole, Jr., Wolfgang Daum | 1996-11-19 |
| 5554305 | Processing low dielectric constant materials for high speed electronics | Robert J. Wojnarowski, Herbert S. Cole, Jr., Wolfgang Daum | 1996-09-10 |
| 5548099 | Method for making an electronics module having air bridge protection without large area ablation | Herbert S. Cole, Jr. | 1996-08-20 |
| 5449427 | Processing low dielectric constant materials for high speed electronics | Robert J. Wojnarowski, Herbert S. Cole, Jr., Wolfgang Daum | 1995-09-12 |
| 5434751 | Reworkable high density interconnect structure incorporating a release layer | Herbert S. Cole, Jr., Robert J. Wojnarowski, John H. Lupinski | 1995-07-18 |
| 5401687 | Process for high density interconnection of substrates and integrated circuit chips containing sensitive structures | Herbert S. Cole, Jr., Bernard Gorowitz | 1995-03-28 |