JL

John H. Lupinski

GE: 18 patents #1,600 of 36,430Top 5%
UE US Dept of Energy: 2 patents #577 of 5,099Top 15%
LM Lockheed Martin: 1 patents #2,805 of 6,507Top 45%
📍 Scotia, NY: #44 of 414 inventorsTop 15%
🗺 New York: #6,536 of 115,490 inventorsTop 6%
Overall (All Time): #212,203 of 4,157,543Top 6%
21
Patents All Time

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDate
5534602 High temperature polyether imide compositions and method for making Herbert S. Cole, Jr. 1996-07-09
5434751 Reworkable high density interconnect structure incorporating a release layer Herbert S. Cole, Jr., Theresa Ann Sitnik-Nieters, Robert J. Wojnarowski 1995-07-18
5310933 Method for preparing polyimides for use in electronic applications Paul Edward Howson 1994-05-10
5300812 Plasticized polyetherimide adhesive composition and usage Theresa A. Sitnik, Thomas Bert Gorczyca, Steven Thomas Rice, Herbert S. Cole, Jr. 1994-04-05
5204395 Flame retardant polyphenylene ether compositions 1993-04-20
5169911 Heat curable blends of silicone polymide and epoxy resin Thomas Bert Gorczyca 1992-12-08
5153251 Flame retardant polycarbonate compositions Christopher M. Hawkins 1992-10-06
5096771 Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether Erik W. Walles, Mark Markovitz, Robert Edgar Colborn, James R. Presley, Michael J. Davis +6 more 1992-03-17
5095053 Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions Erik W. Walles, James V. Crivello 1992-03-10
5064882 Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diarliodonium-hexafluoroantimonate salts and free radical generators Erik W. Walles, James V. Crivello 1991-11-12
5015675 Encapsulation method, microelectronic devices made therefrom, and heat curable compositions based on epoxy resins, diaryliodonium hexafluroantimonate salts and free radical generators Erik W. Walles, James V. Crivello 1991-05-14
4975319 Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether Erik W. Walles, Mark Markovitz, Robert Edgar Colborn, James R. Presley, Michael J. Davis +6 more 1990-12-04
4853423 Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production Erik W. Walles, Mark Markovitz, Robert Edgar Colborn, James R. Presley, Michael J. Davis +6 more 1989-08-01
4842800 Method of encapsulating electronic devices Erik W. Walles, James V. Crivello 1989-06-27
4452938 Amorphous metal composites Martin A. Byrne 1984-06-05
4358419 Method of making amorphous metal composites Martin A. Byrne 1982-11-09
4346136 Bondable magnet wire comprising polyamide-imide coating containing residual solvent 1982-08-24
4271783 Apparatus for fluidized bed-electrostatic coating of indefinite length substrate Bernard Gorowitz 1981-06-09
4257861 Electrocoating compositions and electrocoating method Wilson J. Barnes 1981-03-24
4201837 Bonded amorphous metal electromagnetic components 1980-05-06
4188413 Electrostatic-fluidized bed coating of wire Bernard Gorowitz 1980-02-12