Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Direct stacked and flip chip power semiconductor device structures

Direct stacked and flip chip power semiconductor device structures

US Patent 5532512 · Granted Jul 2, 1996

Estimated economic value: $32,611,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Phased array antenna with isotropic and non-isotropic radiating and omnidirectio2023
Routing method and device of mobile ad-hoc networks2023
Phased array antenna with isotropic and non-isotropic radiating and omnidirectio2022
Phased array antenna with isotropic and non-isotropic radiating and omnidirectio2022
System and method for automatic runtime position sensor offset calibration in a 2022
Articles comprising an infrared blocking layer and methods of making the same2021
Routing method and device of mobile ad-hoc networks2021
System and method for automatic runtime position sensor gain calibration in a li2021
Plastic assembly, methods of making and using the same, and articles comprising 2021
Electronics package including integrated electromagnetic interference shield and2021
Acoustic phased array antenna with isotropic and non-isotropic radiating element2020
Micro-inverter assembly for use in a photovoltaic system and method of making sa2020