Issued Patents All Time
Showing 51–57 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5455459 | Reconstructable interconnect structure for electronic circuits | Herbert S. Cole, Jr. | 1995-10-03 |
| 5422513 | Integrated circuit chip placement in a high density interconnect structure | Walter M. Marcinkiewicz, Barry Scott Whitmore, Robert J. Wojnarowski | 1995-06-06 |
| 5353498 | Method for fabricating an integrated circuit module | Robert J. Wojnarowski, Michael Gdula, Herbert S. Cole, Jr., Eric J. Wildi, Wolfgang Daum | 1994-10-11 |
| 5353195 | Integral power and ground structure for multi-chip modules | Robert J. Wojnarowski | 1994-10-04 |
| 5324987 | Electronic apparatus with improved thermal expansion match | Charles D. Iacovangelo, James F. Burgess | 1994-06-28 |
| 5315486 | Hermetically packaged HDI electronic system | William P. Kornrumpf, Edward S. Bernard | 1994-05-24 |
| 5291066 | Moisture-proof electrical circuit high density interconnect module and method for making same | Constantine A. Neugebauer, Herbert S. Cole, Eugene L. Bartels | 1994-03-01 |