Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8403388 | Hybrid nozzle for pick and place assembly of very small form factor components | Michael Wendt | 2013-03-26 |
| 8132673 | Method and apparatus for retention of small components on adhesive backed carrier tape | — | 2012-03-13 |
| 8069636 | Method and apparatus to facilitate retention and removal of components placed on adhesive backed carrier tape for automated handling | — | 2011-12-06 |
| 7097040 | Adhesive backed carrier tape with calibrated levels of low tack adhesion for retention of small components | — | 2006-08-29 |
| 6357594 | Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes | — | 2002-03-19 |
| 6205745 | High speed flip-chip dispensing | Thomas Dixon Dudderar | 2001-03-27 |
| 5966903 | High speed flip-chip dispensing | Thomas Dixon Dudderar | 1999-10-19 |
| 5960961 | Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes | — | 1999-10-05 |
| 5524765 | Carrier tape packaging system utilizing a layer of gel for retaining small components | — | 1996-06-11 |
| 5203143 | Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system | — | 1993-04-20 |
| 4399910 | Jewelry retaining means including compensation means for dimensional variations in objects retained therein | — | 1983-08-23 |