Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8581375 | Leadframe-based mold array package heat spreader and fabrication method therefor | Kambhampati Ramakrishna, Il Kwon Shim | 2013-11-12 |
| 8211753 | Leadframe-based mold array package heat spreader and fabrication method therefor | Kambhampati Ramakrishna, Il Kwon Shim | 2012-07-03 |
| 7863730 | Array-molded package heat spreader and fabrication method therefor | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow, Dario S. Filoteo, Jr., Virgil Ararao | 2011-01-04 |
| 7399658 | Pre-molded leadframe and method therefor | Il Kwon Shim, Kambhampati Ramakrishna, Seng Guan Chow | 2008-07-15 |
| 7091469 | Packaging for optoelectronic devices | Dean Paul Kossives, Kambhampati Ramakrishna, Edward Law, Theodore G. Tessier, Jamin Ling | 2006-08-15 |