Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7637009 | Approach for fabricating probe elements for probe card assemblies using a reusable substrate | Keith Heinemann, Richard McCullough, Brian McHugh, Jordan L. Wahl | 2009-12-29 |
| 7442641 | Integrated ball and via package and formation process | David T. Beatson | 2008-10-28 |
| 7091469 | Packaging for optoelectronic devices | Dean Paul Kossives, Kambhampati Ramakrishna, Edward Law, Diane Sahakian, Theodore G. Tessier | 2006-08-15 |
| 6445069 | Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor | Dave Charles Stepniak | 2002-09-03 |
| 6191484 | Method of forming planarized multilevel metallization in an integrated circuit | Kuei-Wu Huang, Tsiu C. Chan | 2001-02-20 |
| 6180509 | Method for forming planarized multilevel metallization in an integrated circuit | Kuei-Wu Huang, Tsiu C. Chan | 2001-01-30 |