Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5869894 | RF IC package | Yinon Degani, Peter R. Smith | 1999-02-09 |
| 5834160 | Method and apparatus for forming fine patterns on printed circuit board | Alan Ferry, Byung Joon Han, Maureen Y. Lau, Robert T. Scruton, Sr. | 1998-11-10 |
| 5747982 | Multi-chip modules with isolated coupling between modules | Douglas Dromgoole, Anatoly Feygenson, Robert C. Frye, Ashraf W. Lotfi | 1998-05-05 |
| 5699105 | Curbside circuitry for interactive communication services | Howard Chen, Michael G. Johnson | 1997-12-16 |
| 5622305 | Bonding scheme using group VB metallic layer | Donald D. Bacon, Cheng-Hsuan Chen, Ho S. Chen, Avishay Katz | 1997-04-22 |
| 5608262 | Packaging multi-chip modules without wire-bond interconnection | Yinon Degani, Thomas Dixon Dudderar, Byung Joon Han, Alan Michael Lyons | 1997-03-04 |
| 5564617 | Method and apparatus for assembling multichip modules | Yinon Degani, Thomas Dixon Dudderar | 1996-10-15 |
| 5534465 | Method for making multichip circuits using active semiconductor substrates | Robert C. Frye | 1996-07-09 |
| 5481205 | Temporary connections for fast electrical access to electronic devices | Robert C. Frye, Maureen Y. Lau | 1996-01-02 |
| 5461333 | Multi-chip modules having chip-to-chip interconnections with reduced signal voltage level and swing | Joseph Henry Condon, Robert C. Frye, Thaddeus John Gabara, Scott C. Knauer, Carroll H. Knauer, executor | 1995-10-24 |
| 5234149 | Debondable metallic bonding method | Avishay Katz, Chien-Hsun Lee | 1993-08-10 |
| 5234153 | Permanent metallic bonding method | Donlad D. Bacon, Avishay Katz, Chien-Hsun Lee, Yiu-Man Wong | 1993-08-10 |
| 5197654 | Bonding method using solder composed of multiple alternating gold and tin layers | Avishay Katz, Chien-Hsun Lee, Yiu-Man Wong | 1993-03-30 |
| 5043794 | Integrated circuit package and compact assemblies thereof | John Thomson, Jr. | 1991-08-27 |
| 5000532 | Optical fiber switch | Richard T. Kraetsch, Richard J. Pimpinella, Leonard W. Schaper | 1991-03-19 |
| 4995695 | Optical assembly comprising optical fiber coupling means | Richard J. Pimpinella, John M. Segelken, Ross J. Thompson | 1991-02-26 |
| 4946236 | Movable fiber optical switch | Mindaugas F. Dautartas, Yinon Degani, Richard T. Kraetsch, Richard J. Pimpinella | 1990-08-07 |
| 4896937 | Optical fiber switch | Richard T. Kraetsch, Richard J. Pimpinella, Leonard W. Schaper | 1990-01-30 |
| 4767695 | Nonplanar lithography and devices formed thereby | Edith T. T. Ong, Yiu-Huen Wong | 1988-08-30 |
| 4703288 | Interconnection lines for wafer-scale-integrated assemblies | Robert C. Frye | 1987-10-27 |
| 4670770 | Integrated circuit chip-and-substrate assembly | — | 1987-06-02 |
| 4496448 | Method for fabricating devices with DC bias-controlled reactive ion etching | Frederick Vratny | 1985-01-29 |
| 4454221 | Anisotropic wet etching of chalcogenide glass resists | Cheng-Hsuan Chen, Edith Ong, James C. Phillips | 1984-06-12 |