Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9095054 | High temperature equalized electrical parasitic power packaging method for many paralleled semiconductor power devices | Jack Bourne, Jared Hornberger, Alex Lostetter, Brice McPherson, Ty R. McNutt +4 more | 2015-07-28 |
| 8207021 | Low noise high thermal conductivity mixed signal package | Dennis R. Kling, Bruce William Chignola, David J. Katz, Jorge M. Marcial | 2012-06-26 |
| 8067833 | Low noise high thermal conductivity mixed signal package | Dennis R. Kling, Bruce William Chignola, David J. Katz, Jorge M. Marcial | 2011-11-29 |
| 7049175 | Method of packaging RF MEMS | Ajay P. Malshe, Chad B. O'Neal | 2006-05-23 |
| 7005722 | RC terminator and production method therefor | James Patrick Parkerson | 2006-02-28 |
| 6806568 | Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods | — | 2004-10-19 |
| 6800939 | Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems | — | 2004-10-05 |
| 6707680 | Surface applied passives | — | 2004-03-16 |
| 6516504 | Method of making capacitor with extremely wide band low impedance | — | 2003-02-11 |
| 6388200 | Electronic interconnection medium having offset electrical mesh plane | — | 2002-05-14 |
| 6297460 | Multichip module and method of forming same | — | 2001-10-02 |
| 6272003 | Floating plate capacitor with extremely wide band low impedance | — | 2001-08-07 |
| 6255600 | Electronic interconnection medium having offset electrical mesh plane | — | 2001-07-03 |
| 6023408 | Floating plate capacitor with extremely wide band low impedance | — | 2000-02-08 |
| 5873992 | Method of electroplating a substrate, and products made thereby | John H. Glezen, Hameed A. Naseem, William D. Brown, Ajay P. Malshe | 1999-02-23 |
| 5472370 | Method of planarizing polycrystalline diamonds, planarized polycrystalline diamonds and products made therefrom | Ajay P. Malshe, William D. Brown, Hameed A. Naseem | 1995-12-05 |
| 5410107 | Multichip module | — | 1995-04-25 |
| 5000532 | Optical fiber switch | Richard T. Kraetsch, Richard J. Pimpinella, King Lien Tai | 1991-03-19 |
| 4896937 | Optical fiber switch | Richard T. Kraetsch, Richard J. Pimpinella, King Lien Tai | 1990-01-30 |
| 4675717 | Water-scale-integrated assembly | Victor R. Herrero | 1987-06-23 |
| 4577214 | Low-inductance power/ground distribution in a package for a semiconductor chip | — | 1986-03-18 |