Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Reinforced bond pad for a semiconductor device

Reinforced bond pad for a semiconductor device

US Patent 7115985 · Granted Oct 3, 2006

Estimated economic value: $4,563,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Acoustic filtering circuitry including capacitor2019
Surface acoustic wave filter with a cap layer for improved reliability2018
Integration of shallow trench isolation and through-substrate vias into integrat2017
Methods, systems, and apparatuses for temperature compensated surface acoustic w2016
Stacked interconnect heat sink2015
Method of fabrication of through-substrate vias2015
Preventing electronic device counterfeits2014
Integration of shallow trench isolation and through-substrate vias into integrat2014
High coupling, low loss saw filter and associated method2013
Solder bump structure for flip chip semiconductor devices and method of manufact2013
Stacked interconnect heat sink2013
Routing under bond pad for the replacement of an interconnect layer2012