Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integration of shallow trench isolation and through-substrate vias into integrated circuit designs

Integration of shallow trench isolation and through-substrate vias into integrated circuit designs

US Patent 9613847 · Granted Apr 4, 2017

Estimated economic value: $50,315,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid integrated circuit package2025
Thermal interface material containment2025
Opto-electronic package and a method for making an opto-electronic package2023
Low-cost nano-heat pipe2021
Tunable waveguide devices2020
Photonic integrated circuit package2019
Tunable waveguide devices2019
Tunable waveguide devices2019
Tunable waveguide devices2019
Low-cost nano-heat pipe2019
Tunable waveguide devices2019
Tunable waveguide devices2018