Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7982307 | Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate | Ahmed Amin, John W. Osenbach, Thomas H. Shilling, Brian T. Vaccaro | 2011-07-19 |
| 7671436 | Electronic packages | Ahmed Amin, Mark A. Bachman, John W. Osenbach, Brian T. Vaccaro | 2010-03-02 |
| 7479695 | Low thermal resistance assembly for flip chip applications | Mark A. Bachman | 2009-01-20 |