Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Low thermal resistance assembly for flip chip applications

Low thermal resistance assembly for flip chip applications

US Patent 7479695 · Granted Jan 20, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integration of shallow trench isolation and through-substrate vias into integrat2017
Pb-free solder bumps with improved mechanical properties2016
Stacked interconnect heat sink2015
Method of fabrication of through-substrate vias2015
PB-free solder bumps with improved mechanical properties2014
Integration of shallow trench isolation and through-substrate vias into integrat2014
Solder interconnect by addition of copper2013
Solder bump structure for flip chip semiconductor devices and method of manufact2013
Stacked interconnect heat sink2013
Solder interconnect by addition of copper2013
Routing under bond pad for the replacement of an interconnect layer2012
Integrated circuit chip assembly having array of thermally conductive features a2011