Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8228679 | Connections for electronic devices on double-sided circuit board | Todd Snider, Melissa Grupen-Shemansky | 2012-07-24 |
| 8133799 | Controlling warping in integrated circuit devices | John W. Osenbach, Weidong Xie | 2012-03-13 |
| 7982307 | Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate | Ahmed Amin, David Crouthamel, John W. Osenbach, Brian T. Vaccaro | 2011-07-19 |
| 7923347 | Controlling warping in integrated circuit devices | John W. Osenbach, Weidong Xie | 2011-04-12 |
| 7598602 | Controlling warping in integrated circuit devices | John W. Osenbach, Weidong Xie | 2009-10-06 |
| 7541669 | Semiconductor device package with base features to reduce leakage | Patrick Carberry, Jeffery Gilbert, George Libricz, Ralph Salvatore Moyer, John W. Osenbach +1 more | 2009-06-02 |
| 7433192 | Packaging for electronic modules | Timothy Brooks Bambridge, Juan Alejandro Herbsommer, Osvaldo Jorge Lopez, Joel M. Lott, Hugo Safar | 2008-10-07 |
| 7408246 | Controlling warping in integrated circuit devices | John W. Osenbach, Weidong Xie | 2008-08-05 |
| 7242090 | Device package | John Brennan, Joseph Freund, Ralph Salvatore Moyer, John W. Osenbach, Hugo Safar | 2007-07-10 |
| 7224047 | Semiconductor device package with reduced leakage | Patrick Carberry, Jeffery Gilbert, George Libricz, Ralph Salvatore Moyer, John W. Osenbach +1 more | 2007-05-29 |
| 6890445 | Process for packaging electronic devices using thin bonding regions | Bradley Paul Barber, LaRue Norman Dunkleberger, Jason Goodelle | 2005-05-10 |
| 6833557 | Integrated circuit and a method of manufacturing an integrated circuit | Vivian W. Ryan | 2004-12-21 |
| 6621280 | Method of testing an integrated circuit | Vivian W. Ryan | 2003-09-16 |