Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749515 | Tapered magnetic ion transport tunnel for particle collection | Sameh S. Wanis, Carl B. Freidhoff, Clinton Ung | 2023-09-05 |
| 10755827 | Radiation shield | Sameh S. Wanis, Carl B. Freidhoff, Clinton Ung | 2020-08-25 |
| 10291231 | Superconducting device with dummy elements | Eric J. Jones | 2019-05-14 |
| 9297775 | Combinatorial screening of metallic diffusion barriers | Edwin Adhiprakasha, Sean Barstow, Ashish Bodke, Zhendong Hong, Usha Raghuram +3 more | 2016-03-29 |
| 9269615 | Multi-layer barrier layer for interconnect structure | Xunyuan Zhang, Paul R. Besser | 2016-02-23 |
| 9209135 | Method for reducing wettability of interconnect material at corner interface and device incorporating same | Xunyuan Zhang, Hoon Kim | 2015-12-08 |
| 9076792 | Multi-layer barrier layer stacks for interconnect structures | Xunyuan Zhang, Paul R. Besser | 2015-07-07 |
| 9059255 | Methods of forming non-continuous conductive layers for conductive structures on an integrated circuit product | Xunyuan Zhang | 2015-06-16 |
| 9021894 | Detecting anomalous weak BEOL sites in a metallization system | Holm Geisler, Dirk Breuer | 2015-05-05 |
| 8950269 | Detecting anomalous stiff pillar bumps formed above a metallization system | Holm Geisler, Dirk Breuer | 2015-02-10 |
| 8928146 | Bond pad configurations for controlling semiconductor chip package interactions | — | 2015-01-06 |
| 8877633 | Methods of forming a barrier system containing an alloy of metals introduced into the barrier system, and an integrated circuit product containing such a barrier system | Xunyuan Zhang, Hoon Kim | 2014-11-04 |
| 8829675 | Repairing anomalous stiff pillar bumps | Holm Geisler, Dirk Breuer | 2014-09-09 |
| 8772158 | Multi-layer barrier layer stacks for interconnect structures | Xunyuan Zhang, Paul R. Besser | 2014-07-08 |
| 8728931 | Multi-layer barrier layer for interconnect structure | Xunyuan Zhang, Paul R. Besser | 2014-05-20 |
| 8722534 | Method for reducing wettability of interconnect material at corner interface and device incorporating same | Xunyuan Zhang, Hoon Kim | 2014-05-13 |
| 8680681 | Bond pad configurations for controlling semiconductor chip package interactions | — | 2014-03-25 |
| 8664759 | Integrated circuit with heat conducting structures for localized thermal control | — | 2014-03-04 |
| 8623754 | Repairing anomalous stiff pillar bumps | Holm Geisler, Dirk Breuer | 2014-01-07 |
| 8623758 | Subtractive metal multi-layer barrier layer for interconnect structure | Xunyuan Zhang, Paul R. Besser | 2014-01-07 |
| 8441131 | Strain-compensating fill patterns for controlling semiconductor chip package interactions | — | 2013-05-14 |
| 7973544 | Thermal monitoring and management of integrated circuits | Vance D. Archer, III, Daniel Chesire, Warren K. Gladden, Seung H. Kang, Taeho Kook +1 more | 2011-07-05 |
| 7800879 | On-chip sensor array for temperature management in integrated circuits | — | 2010-09-21 |
| 7745927 | Heat sink formed of multiple metal layers on backside of integrated circuit die | Richard Shanaman | 2010-06-29 |
| 7705473 | Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit | Sean Lian, Debra Louise Yencho | 2010-04-27 |