Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7745927 | Heat sink formed of multiple metal layers on backside of integrated circuit die | Vivian W. Ryan | 2010-06-29 |
| 7214568 | Semiconductor device configured for reducing post-fabrication damage | John Brennan, Joseph Michael Freund, Sujal Shah | 2007-05-08 |
| 7075174 | Semiconductor packaging techniques for use with non-ceramic packages | John Brennan, Joseph Michael Freund, Curtis Miller | 2006-07-11 |
| 5366924 | Method of manufacturing an integrated circuit including planarizing a wafer | William Easter | 1994-11-22 |
| H1174 | Wafer bonded dielectrically isolated structures | William Easter | 1993-04-06 |
| H1137 | Wafer bonding technique for dielectric isolation processing | William Easter | 1993-02-02 |