Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136615 | Electronic package with interposer between integrated circuit dies | Matthew Essar, Christopher Sanabria, Zhunming Du | 2024-11-05 |
| 8025201 | Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles | Nelson Troncoso | 2011-09-27 |
| 7977804 | Ball-bump bonded ribbon-wire interconnect | Dale E. Christensen | 2011-07-12 |
| 7074705 | Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles | Nelson Troncoso | 2006-07-11 |
| 7075174 | Semiconductor packaging techniques for use with non-ceramic packages | John Brennan, Joseph Michael Freund, Richard Shanaman | 2006-07-11 |