Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8025201 | Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles | Curtis Miller | 2011-09-27 |
| 7074705 | Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles | Curtis Miller | 2006-07-11 |