Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8228679 | Connections for electronic devices on double-sided circuit board | Thomas H. Shilling, Todd Snider | 2012-07-24 |
| 7901955 | Method of constructing a stacked-die semiconductor structure | — | 2011-03-08 |
| 6482289 | Nonconductive laminate for coupling substrates and method therefor | Treliant Fang, Shun-Meen Kuo | 2002-11-19 |
| 6022761 | Method for coupling substrates and structure | Jong-Kai Lin, Theodore G. Tessier | 2000-02-08 |
| 5346848 | Method of bonding silicon and III-V semiconductor materials | Bertrand F. Cambou | 1994-09-13 |
| 5268065 | Method for thinning a semiconductor wafer | — | 1993-12-07 |
| 5080933 | Selective deposition of polycrystalline silicon | Hang M. Liaw | 1992-01-14 |